363-206-204
About This Document
Issue 9 October 1998 xxxvii
Electrostatic Discharge(ESD) Considerations
!
CAUTION:
Industry experience has shown that all integrated circuit packs can be dam-
aged by static electricity that builds up on work surfaces and personnel. The
static charges are produced by various charging effects of movement and
contact with other objects. Dry air allows greater static charges to accumu-
late. Higher potentials are measured in areas with low relative humidity, but
potentials high enough to cause damage can occur anywhere.
The following list of precautions should be observed when handling circuit packs
in order to prevent damage by electrostatic discharge:
■
Assume all circuit packs contain solid state electronic components that can
be damaged by ESD.
■
When handling circuit packs (storing, inserting, removing, etc.) or when
working on the backplane, always wear a grounded wrist strap or wear a
heel strap and stand on a grounded, static-dissipating floor mat. If a
static-dissipating floor mat is used, be sure that it is clean to ensure a good
discharge path.
■
Handle all circuit packs by the faceplate or latch and by the top and bottom
outermost edges. Never touch the components, conductors, or connector
pins.
■
Observe warning labels on bags and cartons. Whenever possible, do not
remove circuit packs from antistatic packaging until ready to insert them
into slots.
■
If possible, open all circuit packs at a static-safe work position, using prop-
erly grounded wrist straps and static-dissipating table mats. If a static-dissi-
pating floor mat is used, be sure that it is clean to ensure a good discharge
path.
■
Always store and transport circuit packs in static-safe packaging. Shielding
is not required unless specified.
■
Keep all static-generating materials such as food wrappers, plastics, and
styrofoam containers away from all circuit packs. Upon removal from bay,
immediately put circuit packs into static-safe packages.
■
Whenever possible, maintain relative humidity above 20 percent.
Summary of Contents for DDM-2000 OC-3
Page 4: ...Issue 9 October 1998 363 206 204 Lucent Technologies ...
Page 9: ...363 206 204 Issue 9 October 1998 Lucent Technologies ...
Page 10: ...Issue 9 October 1998 363 206 204 Lucent Technologies ...
Page 24: ...xxiv Issue 9 October 1998 363 206 204 ...
Page 32: ...xxxii Issue 9 October 1998 363 206 204 ...
Page 34: ...xxxiv Issue 9 October 1998 363 206 204 ...
Page 58: ...1 ii Issue 9 October 1998 363 206 204 ...
Page 74: ...2 iv Issue 9 October 1998 363 206 204 ...
Page 144: ...2 70 Issue 9 October 1998 363 206 204 Equipment and Rear Access Cable Installation ...
Page 192: ...3 46 Issue 9 October 1998 363 206 204 Equipment and Front Access Cable Installation ...
Page 304: ...6 30 Issue 9 October 1998 363 206 204 Release 7 Installation Tests ...
Page 330: ...7 24 Issue 9 October 1998 363 206 204 Release 8 Installation Tests ...
Page 398: ...9 32 Issue 9 October 1998 363 206 204 Release 13 TARP Installation Tests ...
Page 426: ...11 ii Issue 9 October 1998 363 206 204 ...
Page 492: ...IN 14 Issue 9 October 1998 ...