CDD3000-HF Operation Manual
A-9
DE
EN
FR
IT
ES
FR
A.3
Project planning
notes, “Cold
plate”
Subject
Project planning notes
Thermal connection to
cooler
•
Evenness of contact surface = 0.05 mm
Roughness of contact surface = roughness factor 6.3
•
Coat area between drive controller (“cold plate” backing plate) and cooler with heat transfer
compound (coat thickness 30-70µ).
•
The temperature in the middle of the drive controller backing plate must not exceed 85 °C.
Distribution of
power loss
Size
Device rated power
[kVA]
Heat sink
Housing
BG 1/2
BG 3
BG 4
BG 5
1.0 to 3.9
5.4 to 6.9
9.7 to 11.8
16.6 to 22.2
approx. 65%
approx. 70%
approx. 75%
approx. 80%
approx. 35%
approx. 30%
approx. 25%
approx. 20%
Active cooling area
Size
Device rated
power [kVA]
Device basic area
[mm]
Active cooling area
[mm]
B
H
a
b
BG 1
BG 2
BG 3
BG 4
BG 5
1.0 to 1.6
2.2 to 3.9
5.4 to 6.9
9.7 to 11.8
16.6 to 22.2
70
70
100
150
200
193
218
303
303
303
50
90
120
65
80
165
200
260
215
300
Thermal resistance
Size
Device rated power
[kVA]
Thermal resistance between
active cooling area and cooler
R
th
[K/W]
BG 1
BG 2
BG 3
BG 4
BG 5
1.0 to 1.6
2.2 to 3.9
5.4 to 6.9
9.7 to 11.8
16.6 to 22.2
0.05
0.05
0.03
0.02
0.015
a
b
B
H
Heat transfer
compound
Backing plate
CDD3000
Cooler
R
th
