Micro Crystal
Low Power Clock Oscillator 32.768 kHz
OV-7605-C8
June 2017
10/20
Rev. 1.0
4. PACKAGE
DIMENSIONS AND SOLDER PAD LAYOUT
4.1.
OV-C8 Package:
Package dimensions (bottom view): Recommended solder pad layout:
0
,8
5
m
a
x
1
,2
0
,4
5
0
,4
5
2.0
0,45
0,45
1
2
4
3
0
,3
0,7
1,1
0,7
0
,7
0
,7
Tolerances: unless otherwise specified ± 0.1mm
Drawing: OV-7605-C8_Pack-drw_20170323
All dimensions in mm typical.
RECOMMENDED THERMAL RELIEF
4.1.1.
When connecting a pad to a copper plane, thermal relief is recommended.
GOOD
BAD
P
O
