MeiG
Product
Manual
of
SLM750
Module
SLM750
Module
Hardware
Design
Page 72, total 84 pages
GSM voice call
GSM900 PCL=5 @32.21dBm
237.1
mA
DCS1800 PCL=0 @28.14dBm
200.7
mA
GSM850 PCL=5 @32.12dBm
243.9
mA
CDMA voice
call
BC0 @20.31dBm
556
mA
WCDMA voice
call
WCDMA Band 1@23.1dBm
461.8
mA
WCDMA Band 5@22.0dBm
574.3
mA
WCDMA Band 8@22.8dBm
559
mA
6.5 Environmental Reliability Requirements
Table 36: Environmental reliability requirements
Test item
Test condition
Low temperature
storage test
-45
℃
, last for 24 hours in shutdown mode
High temperature
storage test
+90
℃
, last for 24 hours in shutdown mode
Temperature impact
test
In shutdown mode, last for 1 hour in -45
℃
and +90
℃
. Temperature
conversion time is <3min, total 24 cycles.
High temperature high
humidity test
+85
℃
,95%RH,last for 48 hours in shutdown mode
Low temperature
operation test
-30
℃
,last for 24 hours in operation mode
High temperature
operation test
+75
℃
,last for 24 hours in operation mode
Vibration test
Perform vibration tests as required in the following table:
Frequency
Random vibration ASD(Acceleration
spectral density)
5~20Hz 0.96m
2
/s
3
20~500Hz 0.96m
2
/s
3
(20Hz),other -3dB/times
frequency range
Connector life test
Board to board connector interface plugging 50 times; RF antenna
interface cable plugging 30 times
ESD test
1
、
The module tests the power PAD and the large area in the call
state, ESD meets:
1)
Contact discharge shall pass ±4KV
、
±5KV test grade
2)
Air discharge shall pass ±8KV
、
±10KV test grade
2
、
the module tests SIM card connector of EVB in shutdown mode,
ESD meets:
