MCP8063 12V 3-PHASE BLDC
SENSORLESS FAN CONTROLLER
DEMONSTRATION BOARD KIT
USER’S GUIDE
2014 - 2015 Microchip Technology Inc.
DS50002248B-page 37
Appendix B. Bill of Materials (BOM)
TABLE B-1:
BILL OF MATERIALS (BOM) - 12V 3-PHASE BLDC SENSORLESS FAN
CONTROLLER DEMONSTRATION BOARD (ADM00532)
Qty
Reference
Description
Manufacturer
Part Number
3
C1, C17, C18
Cap. ceramic 1 µF 6.3V 10% X5R
0603
TDK Corporation
C1608X5R0J105K
3
C2, C5, C19
Cap. ceramic 10 µF 6.3V 20% X5R
0603
TDK Corporation
C1608X5R0J106M080AB
6
C3, C4,
C6 – C8, C13
Cap. ceramic 0.1 µF 25V 20% X7R
0603
TDK Corporation
C1608X7R1E104M080AA
1
C11
Cap. ceramic 0.22 µF 16V 10% X7R
0603
TDK Corporation
C1608X7R1C224K080AC
5
C9, C10, C12,
C14, C15
Cap. ceramic 10 µF 10V Y5V 1206
TDK Corporation
C3216Y5V1A106Z/1.15
1
C16
Cap. alum. 150 µF 25V 20% SMD
Panasonic
®
- ECG
EEE-FTE151XAP
3
D1 – D3
LED chip-led 633 NM red 0805 SMD OSRAM
Opto Semiconductors
GmbH.
LS R976-NR-1
1
D4
Schottky diode 30V 0.2A SOD323
NXP Semiconductor
1PS76SB10,115
1
J1
Conn. USB recept. 5 POS rt. angle
Molex
®
548190519
2
J2, J5
Conn. header 5 POS 0.050" T/H
gold
Samtec, Inc.
TMS-105-02-G-S
1
J3
Conn. recept. 5 POS 0.100 vert.
gold
TE Connectivity, Ltd.
5-534237-3
1
J4
Conn. recept. 6 POS 0.100 vert.
gold
TE Connectivity, Ltd.
534237-4
1
L1
Inductor power 22 µH 30% shield
SMD
Bourns
®
, Inc.
SRU1048-220Y
PCB
Printed Circuit Board – MCP8063
12V 3-Phase BLDC Sensorless Fan
Controller Demonstration Board
—
104-00532
1
Q1
MOSFET N-Channel dual 30V
8-SOIC
Vishay Siliconix
SI4330DY-T1-E3
5
R1, R2, R9,
R10, R16
Res. 1.00 k
1/10W 1% 0603
TE Connectivity, Ltd.
1622866-1
1
R3
Res. 100 k
1/10W 1% 0603
TE Connectivity, Ltd.
1622827-1
5
R4 – R7, R11
Res. 10.0 k
1/10W 1% 0603
TE Connectivity, Ltd.
1622829-1
3
R13 – R15
Res. 4.02 k
1/10W 1% 0603 SMD Panasonic - ECG
ERJ-3EKF4021V
1
R8
Res. 470
1/10W 1% 0603 SMD
Panasonic - ECG
ERJ-3EKF4700V
1
R12
Res. 0.1
1/3W 1% 1210 SMD
Panasonic - ECG
ERJ-L14KF10CU
2
TP1, TP2
PC test point mini SMD
Keystone Electronics
Corp.
5019
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The
released BOM used in manufacturing uses all RoHS-compliant components.
Summary of Contents for MCP8063
Page 27: ...2014 2015 Microchip Technology Inc DS50002248B page 27 A 3 BOARD TOP SILK...
Page 29: ...2014 2015 Microchip Technology Inc DS50002248B page 29 A 5 BOARD TOP COPPER...
Page 31: ...2014 2015 Microchip Technology Inc DS50002248B page 31 A 7 BOARD BOTTOM COPPER AND SILK...
Page 39: ...2014 2015 Microchip Technology Inc DS50002248B page 39 NOTES...
