PIC16C62B/72A
1998-2013 Microchip Technology Inc.
Preliminary
DS35008C-page 105
15.0
PACKAGING INFORMATION
15.1
Package Marking Information
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
AABBCDE
MMMMMMMMMMMMMMMM
Example
PIC16C62B-20/SO
XXXXXXXXXXXXXXX
AABBCDE
28-Lead PDIP (Skinny DIP)
MMMMMMMMMMMM
Example
PIC16C72A-04/SP
Example
28-Lead CERDIP Windowed
XXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
PIC16C72A/JW
AABBCDE
XXXXXXXXXXXX
XXXXXXXXXXXX
28-Lead SSOP
20I/SS025
PIC16C62B
Example
1317HAT
1317CAT
1310/SAA
1317SBP
XXXXXXXXXXX
Legend:
MM...M
Microchip part number information
XX...X
Customer specific information*
AA
Year code (last 2 digits of calendar year)
BB
Week code (week of January 1 is week ‘01’)
C
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
D
Mask revision number
E
Assembly code of the plant or country of origin in which
part was assembled
Note
:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
Summary of Contents for PIC16C62B/72A
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