PIC16C63A/65B/73B/74B
DS30605C-page 162
2000 Microchip Technology Inc.
18.9
44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead
Form (MQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-022
Drawing No. C04-071
B
D1
E
CH
15
10
5
15
10
5
β
Mold Draft Angle Bottom
15
10
5
15
10
5
α
Mold Draft Angle Top
0.45
0.38
0.30
.018
.015
.012
Lead Width
0.23
0.18
0.13
.009
.007
.005
c
Lead Thickness
11
11
n1
Pins per Side
10.10
10.00
9.90
.398
.394
.390
Molded Package Length
10.10
10.00
9.90
.398
.394
.390
E1
Molded Package Width
13.45
13.20
12.95
.530
.520
.510
D
Overall Length
13.45
13.20
12.95
.530
.520
.510
Overall Width
7
3.5
0
7
3.5
0
φ
Foot Angle
1.03
0.88
0.73
.041
.035
.029
L
Foot Length
0.25
0.15
0.05
.010
.006
.002
A1
Standoff
§
2.10
2.03
1.95
.083
.080
.077
A2
Molded Package Thickness
2.35
.093
A
Overall Height
0.80
.031
p
Pitch
44
44
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS*
INCHES
Units
2
1
n
D1
D
B
p
E
E1
#leads=n1
c
β
φ
α
A2
A
CH x 45
°
L
Pin 1 Corner Chamfer
Footprint (Reference)
(F)
.063
1.60
.025
.035
.045
0.64
0.89
1.14
(F)
A1
.079
.086
2.00
2.18
§ Significant Characteristic
Summary of Contents for PIC16C63A
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