2003 Microchip Technology Inc.
DS39582B-page 175
PIC16F87XA
17.1
DC Characteristics:
PIC16F873A/874A/876A/877A (Industrial, Extended)
PIC16LF873A/874A/876A/877A (Industrial)
PIC16LF873A/874A/ 876A/877A
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤
T
A
≤
+85°C for industrial
PIC16F873A/874A/876A/877A
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤
T
A
≤
+85°C for industrial
-40°C
≤
T
A
≤
+125°C for extended
Param
No.
Symbol
Characteristic/
Device
Min
Typ†
Max
Units
Conditions
V
DD
Supply Voltage
D001
16LF87XA
2.0
—
5.5
V
All configurations
(DC to 10 MHz)
D001
16F87XA
4.0
—
5.5
V
All configurations
D001A
V
BOR
5.5
V
BOR enabled, F
MAX
= 14 MHz
(7)
D002
V
DR
RAM Data Retention
Voltage
(1)
—
1.5
—
V
D003
V
POR
V
DD
Start Voltage to
ensure internal Power-on
Reset signal
—
V
SS
—
V
See Section 14.5 “Power-on
Reset (POR)” for details
D004
S
VDD
V
DD
Rise Rate to ensure
internal Power-on Reset
signal
0.05
—
—
V/ms
See Section 14.5 “Power-on
Reset (POR)” for details
D005
V
BOR
Brown-out Reset
Voltage
3.65
4.0
4.35
V
BODEN bit in configuration word
enabled
Legend: Rows with standard voltage device data only are shaded for improved readability.
† Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1:
This is the limit to which V
DD
can be lowered without losing RAM data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading, switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption.
The test conditions for all I
DD
measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD
;
MCLR = V
DD
; WDT enabled/disabled as specified.
3:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD
and V
SS
.
4:
For RC osc configuration, current through R
EXT
is not included. The current through the resistor can be
estimated by the formula Ir = V
DD
/2R
EXT
(mA) with R
EXT
in k
Ω
.
5:
Timer1 oscillator (when enabled) adds approximately 20
µ
A to the specification. This value is from
characterization and is for design guidance only. This is not tested.
6:
The
∆
current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD
or I
PD
measurement.
7:
When BOR is enabled, the device will operate correctly until the V
BOR
voltage trip point is reached.
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