MCP25625 PICTAIL™ PLUS
DAUGHTER BOARD
USER’S GUIDE
2015 Microchip Technology Inc.
DS50002414A-page 21
Appendix B. Bill Of Materials (BOM)
TABLE B-1:
BILL OF MATERIALS
Qty.
Reference
Description
Manufacturer
Part Number
9
+3.3V, +5V,
CANH, CANL,
TP4, TP5, TP6,
TP7, VDD
Conn. TP Loop Tin SMD
Harwin Plc.
S1751-46R
2
C1, C14
Cap. ceramic 10 µF 6.3V 10% X5R SMD 0805 KEMET
®
C0805C106K9PACTU
6
C2, C7, C11,
C12, C13, C15
Cap. ceramic 0.1 µF 25V 10% X7R SMD 0805 Murata Electronics
®
GRM21BR71E104KA01L
2
C8, C10
Cap. ceramic 47 pF 200V 5% C0G, NP0 SMD
0805
KEMET
C0805C470J2GACTU
1
C9
Cap. ceramic 4700 pF 100V 10% X7R SMD
0805
TDK Corporation
C2012X7R2A472K
2
D3, D4
Diode TVS MMBZ27VCLT1G 22V 40W
SOT-23-3
ON Semiconductor
®
MMBZ27VCLT1G
3
INT, RXD, TXD
Diode LED red 1.7V 20 mA 11.7mcd
Diffuse SMD 0805
CML Technologies
GmbH & Co. KG
7012X1
1
J1
Conn. header-2.54 male 1x10 Gold 5.84MH TH
vert.
Samtec, Inc.
TSW-110-07-L-S
1
J3
Conn. header-2.54 male 1x6 Tin 5.84MH TH
vert.
Sullins Connector
Solutions
PEC06SAAN
1
J5
Conn. DSUB DE-9 male TH R/A
FCI
10090097-P094VLF
2
JP1, JP2
Conn. header-2.54 male 1x3 Tin 5.84MH TH
vert.
Samtec, Inc.
TSW-103-07-T-S
2
JP1_shunt,
JP2_shunt
Mech. HW Jumper 2.54 mm 1x2 Handle Gold
TE Connectivity
881545-2
5
JP3, JP4, JP5,
JP6, JP7
Conn. header-2.54 male 1x2 Tin 6.10MH TH
vert.
Molex
®
0022284020
4
PAD1, PAD2,
PAD3, PAD4
Mech. HW Rubber pad Cylindrical D7.9 H5.3
black
3M
SJ61A11
1
PCB
RoHS Compliant Bare PCB,
MCP25625 PICtail™ Plus Daughter Board
Microchip
Technology Inc.
104-10350
4
R1, R2, R3, R6
Res. TKF 10 k
Ω
1% 1/8W SMD 0805
Panasonic
®
– ECG
ERJ-6ENF1002V
3
R4, R5, R7
Res. TKF 470R 1% 1/16W SMD 0805
Stackpole
Electronics, Inc.
RMCF0805FT470R
2
R8, R9
Res. TKF 60.4R 1% 1/4W SMD 1206
Yageo Corporation
RC1206FR-0760R4L
1
SW1
Switch Tact. SPST 32V 50 mA KSR231GLFS
SMD
C&K Components
KSR231GLFS
1
U2
MCHP Interface CAN MCP25625-E/ML QFN-28 Microchip
Technology Inc.
MCP25625T-E/SO
1
X1
Resonator 20M Hz 0.1% SMD CSTCE
Murata Electronics
CSTCE20M0V13L99-R0
Note:
The components listed in this Bill of Materials are representative of the PCB assembly. The
released BOM used in manufacturing uses all RoHS-compliant components.
