2015-2017 Microchip Technology Inc.
DS00001855E-page 31
USB5744
9.3
Package Thermal Specifications
FIGURE 9-1:
SUPPLY RISE TIME MODEL
TABLE 9-1:
PACKAGE THERMAL PARAMETERS
Symbol
°C/W
Velocity (Meters/s)
JA
30
0
26
1
JT
0.2
0
0.3
1
JC
2.6
0
2.6
1
Note:
Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51.
TABLE 9-2:
MAXIMUM POWER DISSIPATION
Parameter
Value
Units
PD(max)
1400
mW
t
10%
10%
90%
Voltage
T
RT
t
90%
Time
100%
3.3 V
VSS
VDD33
90%
100%
1.2 V
VDD12