MICRON
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To meet RoHS (European requirement for lead-free solder), the 60/40 solder alloys are not allowed in the
production process. The RoHS lead-free solder alloys require a working temperature of about 30°C (54°F)
higher than typical 60/40 lead/tin soldering. The lead free solder working temperature is detailed below and
can vary from manufacturer to manufacturer.
Melting point ................................................................220°C (428°F)
Normal operation ...........................................300-360°C (572-680°F)
Production line operation................................360-410°C (680-770°F)
IMPORTANT:
The temperature above 410°C (770°F) is not recommended for normal soldering functions, but
can be used for short periods of time when high temperatures are required. Please note that the lead free
solder alloys require a higher soldering temperature which shortens tip life.
QFP (Quad Flat Package) De-soldering for ICs:
1.
Melt the solder: Hold the iron so that the nozzle is located directly over but not touching the IC, and
allow the hot air to melt the solder. Be careful not to touch the leads of the IC with the nozzle.
2.
Remove the IC: Once the solder has melted, remove the IC by lifting it out with the pliers (tweezers).
3.
Turn the power switch off: After the power switch is off, an automatic blowing function begins sending
cool air through the pipe, in order to cool both the heating element and the handle. So do not
disconnect the plug during this cooling process.
4.
In case you don’t use the unit for a long time, disconnect the plug.
NOTE:
About a minute after the power is switched off, the temperature will drop to 75ºC (167º F), and
the power will automatically shut off.
5.
Remove any remaining solder: After removing the IC, clean the remaining solder chips with a wick or
desoldering tool.
NOTE:
For SOP, PLCC etc. it is recommended that tweezers are used to desolder.
QFP Soldering:
1.
Apply the solder paste: Apply the proper quantity of solder paste and flux (preferably no-clean) and
place the SMD on the PCB.
2.
Preheat SMD.
3.
Soldering: Heat the lead frame evenly.
4.
Washing: When soldering is completed, wash the area with a defluxer.
NOTE:
While there are many advantages of hot air SMD rework, it is also possible to have defects for soldering
BGA. It is recommended that all soldering joints be closely inspected.
T 1287 SPECIFICATIONS
Voltage input: ........................................................................240V AC
Wattage: ..................................................................................1000W
Heating element: ................................................................Nichrome
Temperature range: ............................................................100-480°C
Air flow capacity: ..................................................1.5L/min - 70L/min
Weight: ......................................................................................4.9kg
Dimensions: ....................................................283W x 190D x 120Hm
Summary of Contents for T 1287
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