Optional Feature Modules
Wireless Communication
GDUTUG500/01
CE-500 MDT Hardware Guide
56 / 97
The CE-500 system supports the following Bluetooth communication profiles:
SPP [Service (Serial) Port Profile]
LAP (LAN Access Profile, applicable in professional license only)
PAN (Personal Area Networking) Profile
GAP (Generic Access Profile)
TBD
GOEP (Generic Object Exchange Profile)
TBD
HCRP (Hardcopy Cable Replacement Profile)
TBD
DUN (Dial-Up Network) Profile
TBD
FTP (File Transfer Profile)
TBD
HID (Human Interface Device) Profile
TBD
HFP (Hands-Free Profile)
TBD
HSP (Headset Profile)
TBD
OPP (Object Push Profile)
TBD
W
W
i
i
r
r
e
e
l
l
e
e
s
s
s
s
L
L
A
A
N
N
a
a
n
n
d
d
B
B
l
l
u
u
e
e
t
t
o
o
o
o
t
t
h
h
C
C
l
l
a
a
s
s
s
s
2
2
M
M
o
o
d
d
u
u
l
l
e
e
S
S
p
p
e
e
c
c
i
i
f
f
i
i
c
c
a
a
t
t
i
i
o
o
n
n
s
s
Table 9
– Wireless LAN and Bluetooth Class2 Module Specifications
Functions
Specifications
WLAN Standard
IEEE 802.11b/g, Wi-Fi compliant
Bluetooth Standard
Bluetooth 2.1+EDR (Enhanced Data Rate)
Major Chipset
Marvell 8688
Frequency Range
2.4 GHz ISM radio band
Number of Channels
- 802.11b: USA, Canada and Taiwan
– 11
- Most European Countries
– 13
- France
– 4, Japan – 14
- 802.11g: USA, Canada and Taiwan
– 11
- Most European Countries
– 13
- Japan
– 13
Modulation
- DSSS, OFDM, DBPSK, DQPSK, CCK, 16-
QAM, 64-QAM for WLAN
-
GFSK (1Mbps), Π/4 DQPSK (2Mbps) and
8DPSK (3Mbps) for Bluetooth
Output Power
WLAN:
- 802.11b(Ch1~13): typical 15dBm +/- 2dBm
- 802.11b(Ch14): typical 10dBm +/- 2dBm
- 802.11g: typical 12dBm +/- 2dBm
