MPX-Module 6
miriac SBC-S32V User Manual
V 1.1
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© MicroSys Electronics GmbH 2017
6.1
Mounting/Unmounting
The mounting or unmounting of the module should only be made in a static free
area with full ESD precautions, i.e. as a minimum, a grounded dissipative work
surface of sufficient size and a grounded skin contact wrist strap are necessary.
Make sure, that all parts, the carrier, the module and the heatsink are placed on the
same static free area to avoid any discharges between them during assembly.
To mount the MPX-S32V module, make sure that the carrier is disconnected from
any power or other IO interfaces. Both connector surfaces of the module must be
clean as well as the carrier connector should be checked for bent or dirty contacts.
Check the module and the carrier for foreign or loose parts, which do not belong to
the boards. The screws should have clean threads and be tightened with a
maximum torque of 30Ncm.
Insert or remove the MPX-S32V module always by an angle of about 25° like
shown in the following figure.
The thermal conduction between cooler and CPU is performed via a 1mm thick
thermal pad. Make sure, that this thermal pad is placed over the CPU package
before mounting the heatsink.
