Specifications
Thermal Characteristics
MOTOROLA
DSP56367
3-3
Note:
1.
Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided
printed circuit board per SEMI G38-87 in natural convection.(SEMI is Semiconductor
Equipment and Materials International, 805 East Middlefield Rd., Mountain View, CA 94043,
(415) 964-5111.)
Measurements were done with parts mounted on thermal test boards conforming to
specification EIA/JESD51-3.
2.
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI
G30-88, with the exception that the cold plate temperature is used for the case temperature.
Table 3-2 Thermal Characteristics (Continued)
Characteristic
Symbol
TQFP Value
Unit
Summary of Contents for DSP56367
Page 16: ...xvi MOTOROLA CONTENTS Paragraph Number Title Page Number ...
Page 22: ...xxii MOTOROLA List of Figures Figure Number Title Page Number ...
Page 26: ...xxvi MOTOROLA List of Tables Table Number Title Page Number ...
Page 148: ...4 6 DSP56367 MOTOROLA Design Considerations PLL Performance Issues ...
Page 248: ...9 30 DSP56367 MOTOROLA Serial Host Interface SHI Programming Considerations ...
Page 306: ...10 58 DSP56367 MOTOROLA Enhanced Serial Audio Interface ESAI ESAI Initialization Examples ...
Page 389: ...Bootstrap ROM Contents MOTOROLA DSP56367 A 15 end ...
Page 390: ...A 16 DSP56367 MOTOROLA Bootstrap ROM Contents ...
Page 432: ...C 8 DSP56367 MOTOROLA JTAG BSDL ...
Page 484: ...D 52 DSP56367 MOTOROLA Programmer s Reference ...
Page 490: ...E 6 DSP56367 MOTOROLA Power Consumption Benchmark ...
Page 516: ...F 26 DSP56367 MOTOROLA IBIS Model ...
Page 522: ...Index 6 MOTOROLA Index ...
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