603 Hardware Specifications
25
Figure 15. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Dow-Corning Corporation
517-496-4000
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
Chomerics, Inc.
617-935-4850
77 Dragon Court
Woburn, MA 01888-4850
Thermagon Inc.
216-741-7659
3256 West 25th Street
Cleveland, OH 44109-1668
0
0 . 5
1
1 . 5
2
0
1 0
2 0
3 0
4 0
5 0
6 0
7 0
8 0
Graphite/Oil Sheet (0.005 inch)
Silicone Sheet (0.006 inch)
Floroether Oil Sheet (0.007 inch)
Synthetic Grease
Bare Joint
Specific Thermal Resistance (Kin
2
/W)
Contact Pressure (psi)
Contact Pressure (psi)
Specific
Thermal Resistance (Kin
2
/W)