SyChip/Murata Confidential Page 3 of 31 SN2100 Datasheet Ver. 1.1
Table of Contents
1
SYSTEM DESCRIPTIONS ..................................................................................................................................... 6
1.1
A
PPLICATIONS
........................................................................................................................................................ 6
1.2
M
ODULE
S
UMMARY
............................................................................................................................................... 6
1.3
B
LOCK
D
IAGRAM
................................................................................................................................................... 7
2
MECHANICAL SPECIFICATIONS ..................................................................................................................... 8
2.1
M
ODULE
D
IMENSION
.............................................................................................................................................. 8
2.2
M
ODULE TOP AND SIDE VIEW
................................................................................................................................. 8
2.3
M
ODULE BOTTOM VIEW
.......................................................................................................................................... 9
2.4
D
ETAILED MECHANICAL DATA
(
TOP VIEW
) ........................................................................................................... 10
2.5
M
ODULE
P
IN
-
OUT
................................................................................................................................................. 11
3
DC ELECTRICAL SPECIFICATIONS .............................................................................................................. 13
3.1
T
YPICAL
P
OWER
C
ONSUMPTION
........................................................................................................................... 13
3.2
D
IGITAL
IO
S
PECIFICATION
.................................................................................................................................. 13
4
RF SPECIFICATIONS .......................................................................................................................................... 14
4.1
B
LUETOOTH
S
PECIFICATION
................................................................................................................................. 14
4.2
RF
C
HARACTERISTICS
(TX) ................................................................................................................................. 14
4.3
RF
C
HARACTERISTICS
(RX) ................................................................................................................................. 16
5
ENVIRONMENTAL SPECIFICATIONS ........................................................................................................... 17
5.1
A
BSOLUTE MAXIMUM RATINGS
............................................................................................................................ 17
5.2
O
PERATION CONDITIONS
...................................................................................................................................... 17
6
APPLICATION INFORMATION ........................................................................................................................ 18
6.1
R
ECOMMENDED HOST
(
CUSTOMER
)
CIRCUIT BOARD
PCB
PATTERN
..................................................................... 18
6.2
H
OST
PCB
LAYOUT RECOMMENDATIONS
............................................................................................................. 18
6.3
M
ODULE
L
OCATION
............................................................................................................................................. 19
6.3.1
Location in x-y plane
............................................................................................................................... 19
6.3.2
Location in z-plane
.................................................................................................................................. 21
7
SOFTWARE ........................................................................................................................................................... 22
7.1
S
OFTWARE
A
RCHITECTURE
.................................................................................................................................. 22
7.2
B
LUETOOTH
P
ROFILE
S
TACKS
.............................................................................................................................. 22
8
DEVELOPMENT TOOLS .................................................................................................................................... 23
9
ASSEMBLY INFORMATION ............................................................................................................................. 24
9.1
L
EAD
-
FREE SOLDERING REFLOW PROFILE
............................................................................................................. 24
10
PACKAGING AND MARKING INFORMATION ............................................................................................ 25
10.1
C
ARRIER
T
APE
D
IMENSIONS
............................................................................................................................ 25
10.2
M
ODULE
M
ARKING
I
NFORMATION
.................................................................................................................. 25
11
ORDERING INFORMATION ............................................................................................................................. 26
12
ROHS DECLARATION ........................................................................................................................................ 26
13
REGULATORY INFORMATION ....................................................................................................................... 26
13.1
FCC
N
OTICE
(USA) ........................................................................................................................................ 26
13.2
FCC
L
ABELING
R
EQUIREMENTS
...................................................................................................................... 27
