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Design Guide

 on 

ni.com/manuals

 for more information about how to power the NI sbRIO

device through the RMC.

Caution

 

Exceeding the power limits may cause unpredictable device behavior.

Recommended power supply

55 W, 30 VDC maximum

Power supply voltage range

9 VDC to 30 VDC

Reversed-voltage protection

30 VDC

Power consumption with RMC

29 W maximum

Environmental

Caution

 

Clean the sbRIO-9627 with a soft, nonmetallic brush. Make sure that the

device is completely dry and free from contaminants before returning it to service.

Local ambient operating temperature near
device (IEC 60068-2-1, IEC 60068-2-2)

-40 °C to 85 °C

10

Maximum reported onboard sensor temperature

CPU/FPGA temperature

98 °C

Primary System temperature

85 °C

Secondary System temperature

85 °C

Table 1. Component Maximum Case Temperature

Component

Manufacturer

Maximum Case Temperature

 

 

 

CPU/FPGA

Xilinx

NA

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DDR memory

Micron

95 °C

NAND flash

Micron

89 °C

CPLD

Lattice

94 °C

USB PHY

Microchip

120 °C

ENET PHY

Micrel

120 °C

The sbRIO-9627 includes three onboard temperature monitoring sensors to simplify validation
of a thermal solution by indicating thermal performance during validation and deployment.

10

If you expect ambient temperatures below -20 °C, NI recommends using a 10/100 network
infrastructure or assigning 10/100Mbps communication speeds to the Ethernet Adapter in NI MAX.
Refer to the 

Network/Ethernet Port

 section of this document for more information.

11

Use digital approach to ensure the on-chip temperature reading is below 98°C.

NI sbRIO-9627 Specifications

  | 

© National Instruments

  | 

11

Summary of Contents for NI sbRIO-9627

Page 1: ...Programmable SoC Architecture ARM Cortex A9 Speed 667 MHz Cores 2 Operating system NI Linux Real Time 32 bit Nonvolatile memory1 512 MB Volatile memory DRAM 512 MB Real time clock accuracy 5 ppm Flas...

Page 2: ...Type Xilinx Zynq 7000 XC7Z020 All Programmable SoC Number of logic cells 85 000 Number of flip flops 106 400 Number of 6 input LUTs 53 200 Number of DSP slices 18 x 25 multipliers 220 Available block...

Page 3: ...control RTS CTS XON XOFF DTR DSR None RS 485 Serial Port Number of interfaces Onboard RS 485 1 Serial3 RMC RS 485 via FPGA 3 3 V DIO 2 Serial8 Serial9 Maximum baud rate 460 800 bps Data bits 5 6 7 8...

Page 4: ...ort Number of interfaces Front Panel USB Host 1 USB0 RMC USB Host Device 1 USB1 Compatibility USB 2 0 Hi Speed Maximum data rate 480 Mb s Maximum front panel USB current 900 mA SD Card Slot Number of...

Page 5: ...these requirements and achieve frequencies of up to 10 MHz For more information on using DIO to connect to RMCs visit ni com info and enter the Info Code RMCDIO Input logic levels Input low voltage V...

Page 6: ...s Input range 10 V 5 V 2 V 1 V Maximum working voltage signal common mode 10 V range 11 V 5 V range 10 5 V 2 V range 9 V 1 V range 8 5 V Input impedance Powered on 1 G in parallel with 100 pF Powered...

Page 7: ...2 V range 45 Vrms 1 V range 30 Vrms INL 64 ppm of range maximum DNL No missing codes guaranteed CMRR DC to 60 Hz 80 dB Input bandwidth 3 dB 540 kHz typical Settling error multichannel scanning 60 ppm...

Page 8: ...nal Amplitude dB Frequency Hz 1 V DIFF 2 V DIFF 5 V DIFF 10 V DIFF Figure 3 Settling Error versus Source Impedance Error ppm of Step Size Source Impedance 100 1000 10000 100000 100000 10000 1000 100 1...

Page 9: ...m 40 to 85 C 0 50 0 20 Gain drift 23 ppm of reading C Offset drift 5 4 ppm of range C INL 194 ppm of range maximum DNL 16 ppm of range maximum Capacitive drive 1 5 nF typical Slew rate 3 7 V sec typic...

Page 10: ...ctable device behavior 5 V power output Output voltage 5 V 5 Maximum current 1 5 A Maximum ripple and noise 50 mV 3 3 V_AUX power output Output voltage 3 3 V 5 Maximum current 0 33 A Maximum ripple an...

Page 11: ...ure 98 C Primary System temperature 85 C Secondary System temperature 85 C Table 1 Component Maximum Case Temperature Component Manufacturer Maximum Case Temperature CPU FPGA Xilinx NA11 DDR memory Mi...

Page 12: ...o hot components such as the CPU FPGA or near board edges which can cause inaccurate temperature measurements In addition to the local ambient temperature the case temperature of the components should...

Page 13: ...to designing and manufacturing products in an environmentally responsible manner NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to...

Page 14: ...e United States visit the Worldwide Offices section of ni com niglobal to access the branch office websites which provide up to date contact information Information is subject to change without notice...

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