The sensors measure the CPU/FPGA junction temperature and printed circuit board
temperatures that can be used to approximate the primary and secondary side local ambient
temperatures. This approach is called digital validation. Alternatively, the traditional analog
approach using thermocouples can be used to validate thermal performance. The digital
approach is more accurate for determining the performance of the CPU/FPGA but is more
conservative for determining the local ambient temperatures. NI recommends using digital
validation.
For digital validation, ensure that the reported CPU/FPGA, reported Primary System, and
reported Secondary System temperatures do not exceed any of the maximum temperatures
listed in this document. Thermal validation is complete if the reported temperatures are within
specifications. For more information about how to access the onboard sensors, visit
ni.com/
info
and enter the Info Code
sbriosensors
. If the reported Primary System temperature or
reported Secondary System temperature exceed the maximum temperatures listed in this
document then analog validation may be used for further verification.
For analog validation, measure the local ambient temperature by placing thermocouples on
both sides of the PCB, 5 mm (0.2 in.) from the board surface. Avoid placing thermocouples
next to hot components such as the CPU/FPGA or near board edges, which can cause
inaccurate temperature measurements. In addition to the local ambient temperature, the case
temperature of the components should not exceed the recommended maximum case
temperature.
Note
Some systems may require a heat sink or air flow to remain within the
maximum allowed temperature ranges. You can mount the Thermal Kit for
NI sbRIO-9607/9627/9637 (153901-02) heat spreader on the NI sbRIO device.
Note
The NI sbRIO device thermal performance is greatly influenced by several
factors, including resource utilization, mounting, and adjacent power dissipation.
These factors can substantially affect the achievable external ambient temperature at
which the maximum local and reported temperatures are reached. NI recommends
additional thermal design to remain within the maximum allowed temperature
ranges. For information about and examples of environmental and design factors that
can affect the thermal performance of NI sbRIO systems, visit
ni.com/info
and enter
the Info Code
sbriocooling
. For device-specific guidelines about enabling
proper thermal design, refer to the
NI sbRIO-9627 User Manual
on
ni.com/manuals
.
Storage temperature
(IEC 60068-2-1, IEC 60068-2-2)
-40 °C to 85 °C
Operating humidity (IEC 60068-2-78)
10% RH to 90% RH, noncondensing
Storage humidity (IEC 60068-2-78)
5% RH to 95% RH, noncondensing
Maximum altitude
5,000 m
Pollution Degree (IEC 60664)
2
The NI sbRIO device is intended for indoor use only.
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NI sbRIO-9627 Specifications
