Figure 6. PXIe-1088 Cooling Clearances
PXIe-1088
LOW POWER
2
3
4
1
5
6
7
8
9
44.45 mm
(1.75 in.)
44.45 mm
(1.75 in.)
44.45 mm
(1.75 in.)
44.45 mm
(1.75 in.)
Rack
25.4 mm
(1.00 in.)
Desktop
44.45 mm
(1.75 in.)
44.45 mm
(1.75 in.)
Caution
Failure to provide these clearances may result in undesired thermal-
related issues with the chassis or modules.
To aid in thermal health monitoring for either rack or benchtop use you can monitor the
chassis intake temperatures in Measurement & Automation Explorer (MAX) to ensure the
temperatures do not exceed the ratings in the
Operating Environment
section of the
PXIe-1088
Specifications
.
Additionally, many PXI modules provide temperature values you can monitor to ensure
critical temperatures are not exceeded. Increasing chassis clearances, ventilation, reducing
external ambient temperatures, and removing nearby heat sources are all options for improving
overall chassis thermal performance.
PXIe-1088 User Guide
|
© National Instruments
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