APPENDIX C CONNECTORS FOR TARGET CONNECTION
User’s Manual U11595EJ5V0UM
61
C.2 Cautions on Handling Connectors
(1) When unpacking connectors, first remove the sponge while holding the connector.
(2) When soldering the NQPACK100SD to the target system, cover it with the HQPACK100SD to avoid flux
sputtering.
Recommended soldering conditions … Reflow:
240
°
C, 20 sec. max.
Partial heating: 240
°
C, 10 sec. max. (per pin)
(3) Check for abnormal conditions such as resin burrs or bent pins before setting a device on the NQPACK100SD.
Moreover, check that the hold pins of the HQPACK100SD are not broken or bent before setting the
HQPACK100SD. If there are broken or bent pins, fix them with a thin, flat plate such as a blade.
(4) When securing the YHQPACK100SD (connector for emulator connection) or the HQPACK100SD to the
NQPACK100SD, gently tighten the four screws by using the provided screwdriver or a screwdriver with a torque
gauge, and then tighten them in a crisscross pattern (0.054 N·m max. torque).
Excessive tightening of one screw only may diminish conductivity.
If conductivity is lowered after tightening the screws, avoid tightening them any more. Remove the screws and
check again that the NQPACK100SD is clean and that the device pins are parallel (flat).
(5) Device pins are fragile and may bend if the device is set on and removed from the NQPACK100SD several
times. When setting the device on the NQPACK100SD, check for bent pins and make adjustments as necessary.