N11
Hardware User Guide
Copyright © Neoway Technology Co., Ltd
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7.2
Application Foot Print
Figure 7-2
Recommended PCB foot print (Unit: mm)
7.3
Stencil
The recommended stencil thickness is at least 0.12 mm to 0.15 mm.
7.4
Solder Paste
Do not use the kind of solder paste different from our module technique.
⚫
The melting temperature of solder paste with lead is 35 °C lower than that of solder paste
without lead. It is easy to cause voiding for LCC inside the module after second reflow soldering.