4. Be aware that heat may be transferred to distant flammable materials; Someone must be
present at all times while the device is connected.
This device is not intended to by operated by Individuals with diminished physical, sensory, or mental
capacities or by those who lack experience (such as children), except in the presence of individuals
qualified to provide necessary supervision and guidance
Attached: Technical section-rework process (for reference only)
The air gun with preheating station to facilitate the welding of large flat integrated circuit IC, double
sided board and large components desoldering.
• Remove the components
1. The first successful repair is removing the motherboard fault location component, the solder
heated to the melting point, and then carefully take components from the board.
2. The heating control is a key factor to repair, welding material must be completely melted, so as
avoid to damage the pad and a copper element in the removed. At the same time the
temperature is not too high, to prevent the circuit board heating due to excessive motherboard
distortion.
• Heating of circuit boards and components
1. The advanced rework system uses microcomputer to control the heating process, as close as
possible to the specifications given by the solder paste manufacturer, and shall be combined
with the top and bottom heating.
2. To supplement, at the bottom of the heating circuit board for heat conduction loss, and increase
the temperature of the circuit board; and the top heating is used for heating elements, in
addition to use a large area at the bottom of the heater can eliminate circuit board caused by
local heating excessive distortion.
3. Can use three methods to the motherboard heating, conduction, convection, and heat
conduction effects. When heating the heat source and the motherboard contact (such as the
electric heating board) circuit board components does not apply to the back.
4. The heating element (or top heating) is generally used for gas nozzle, carefully control of the
top heating element, make components uniform heat, is extremely important, especially critical for
small components (Figure 1).
5. In addition to avoid rework of components around again reflow or blow away the small patch
component, nozzle thermal isolation and these components must be, in repair stations
surrounding components on a thin layer of the cover plate or mask. The mask technique is very
effective, but also can be used for model time consuming. BGA desoldering nozzle, it can
reduce the damage of desoldering process on the removal of welding components near the
element and the circuit board.
