7 Technical data
BU 0500 GB
Subject to technical alterations
139
7.6 General conditions for ColdPlate technology
The standard frequency inverter is supplied with a smooth flat mounting surface
instead of a heat sink. This means that the FI must be cooled via the mounting
surface, but has a low installation depth.
For all devices there is no fan.
In the selection of a suitable cooling system (e.g. liquid-cooled mounting plate)
the thermal resistance R
th
and the heat to be dissipated from the P
V
modulus of
the frequency inverter must be taken into account. For example, the supplier of
the appropriate control cabinet system can provide details for the correct
selection of the mounting plate.
The mounting plate has been correctly selected if its R
th
value is less than the
values stated below.
NOTE:
Before the device is fitted to the mounting plate, any protective film
must be removed. A suitable heat-conducting paste must be used.
1~ 115V- devices
P
v
modulus [W]
Max. R
th
[K/W]
SK 5xxE-250-112-O-CP
8.51
3.29
SK 5xxE-370-112-O-CP
11.29
2.48
SK 5xxE-550-112-O-CP
15.98
1.75
SK 5xxE-750-112-O-CP
22.27
1.26
1/3~ 230V devices
P
v
modulus [W]
Max. R
th
[K/W]
SK 5xxE-250-323-A-CP
10.48 2.67
SK 5xxE-370-323-A-CP
14.11 1.98
SK 5xxE-550-323-A-CP
20.38 1.37
SK 5xxE-750-323-A-CP
29.09 0.96
SK 5xxE-111-323-A-CP
44.04 0.48
SK 5xxE-151-323-A-CP
55.08 0.38
SK 5xxE-221-323-A-CP *
67.96 0.31
SK 5xxE-301-323-A-CP
83.37 0.25
SK 5xxE-401-323-A-CP
113.88 0.18
*) NOTE:
In contrast to the standard device, SK 500E-221-323-A-CP for S1 operation can
only be supplied in size 3.
