PRELIMINARY ISD1700 SERIES
Publication Release Date: Nov 6, 2008
- 7 -
Revision 1.31
2 FEATURES
y
Integrated message management systems for single-chip, push-button applications
o
REC
:
level-trigger for recording
o
PLAY
:
edge-trigger for individual message or level-trigger for looping playback sequentially
o
ERASE
:
edge-triggered erase for first or last message or level-triggered erase for all messages
o
FWD
:
edge-trigger to advance to the next message or fast message scan during the playback
o
VOL
: 8 levels output volume control
o
INT
RDY
: ready or busy status indication
o
RESET
: return to the default state
o
Automatic power-down after each operation cycle
y
Selectable sampling frequency controlled by an external oscillator resistor
Sampling Frequency
12 kHz
8 kHz
6.4 kHz
5.3 kHz
4 kHz
Rosc
53 k
Ω
80
k
Ω
100
k
Ω
120
k
Ω
160
k
Ω
y
Selectable message duration
o
A wide range selection from 30 secs to 240 secs at 8 kHz sampling frequency
y
Message and operation indicators
o
Four customizable Sound Effects (SEs) for audible indication
o
Optional vAlert (voiceAlert) to indicate the presence of new messages
o
LED: stay on during recording, blink during playback, forward and erase operations
y
Dual operating modes
o
Standalone mode:
Integrated message management techniques
Automatic power-down after each operation cycle
o
SPI mode:
Fully user selectable and controllable options via APC register and various SPI commands
y
Two individual input channels
o
MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control)
o
AnaIn: single-ended auxiliary analog input for recording or feed-through
y
Dual output channels
o
Differential PWM Class D speaker outputs directly drives an 8
Ω
speaker or a typical buzzer
o
Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier
y
ChipCorder standard features
o
High-quality, natural voice and audio reproduction
o
2.4V to 5.5V operating voltage
o
100-year message retention (typical)
o
100,000 record cycles (typical)
y
Temperature
options:
o
Commercial:
0
°
C to +50
°
C (die); 0
°
C to +70
°
C (packaged units)
o
Industrial:
-40
°
C to +85
°
C (packaged units)
y
Packaging types: available in die, PDIP, SOIC and TSOP
y
Package option: Lead-free packaged units
