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2001 Nov 02

7

 

NXP Semiconductors

Product specification

750 MHz, 18.5 dB gain power doubler 
amplifier

BGD712

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published 

and may differ in case of multiple devices. The latest product status information is available on the Internet at 
URL http://www.nxp.com. 

DOCUMENT

STATUS

(1)

PRODUCT 
STATUS

(2)

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product 
development. 

Preliminary data sheet

Qualification

This document contains data from the preliminary specification. 

Product data sheet

Production

This document contains the product specification. 

DISCLAIMERS

Limited warranty and liability

 

 Information in this 

document is believed to be accurate and reliable. 
However, NXP Semiconductors does not give any 
representations or warranties, expressed or implied, as to 
the accuracy or completeness of such information and 
shall have no liability for the consequences of use of such 
information. 

In no event shall NXP Semiconductors be liable for any 
indirect, incidental, punitive, special or consequential 
damages (including - without limitation - lost profits, lost 
savings, business interruption, costs related to the 
removal or replacement of any products or rework 
charges) whether or not such damages are based on tort 
(including negligence), warranty, breach of contract or any 
other legal theory. 

Notwithstanding any damages that customer might incur 
for any reason whatsoever, NXP Semiconductors’ 
aggregate and cumulative liability towards customer for 
the products described herein shall be limited in 
accordance with the 

Terms and conditions of commercial 

sale

 of NXP Semiconductors.

Right to make changes

 

 NXP Semiconductors 

reserves the right to make changes to information 
published in this document, including without limitation 
specifications and product descriptions, at any time and 
without notice. This document supersedes and replaces all 
information supplied prior to the publication hereof.

Suitability for use

 

 NXP Semiconductors products are 

not designed, authorized or warranted to be suitable for 
use in life support, life-critical or safety-critical systems or 
equipment, nor in applications where failure or malfunction 
of an NXP Semiconductors product can reasonably be 
expected to result in personal injury, death or severe 

property or environmental damage. NXP Semiconductors 
accepts no liability for inclusion and/or use of NXP 
Semiconductors products in such equipment or 
applications and therefore such inclusion and/or use is at 
the customer’s own risk.

Applications

 

 Applications that are described herein for 

any of these products are for illustrative purposes only. 
NXP Semiconductors makes no representation or 
warranty that such applications will be suitable for the 
specified use without further testing or modification. 

Customers are responsible for the design and operation of 
their applications and products using NXP 
Semiconductors products, and NXP Semiconductors 
accepts no liability for any assistance with applications or 
customer product design. It is customer’s sole 
responsibility to determine whether the NXP 
Semiconductors product is suitable and fit for the 
customer’s applications and products planned, as well as 
for the planned application and use of customer’s third 
party customer(s). Customers should provide appropriate 
design and operating safeguards to minimize the risks 
associated with their applications and products. 

NXP Semiconductors does not accept any liability related 
to any default, damage, costs or problem which is based 
on any weakness or default in the customer’s applications 
or products, or the application or use by customer’s third 
party customer(s). Customer is responsible for doing all 
necessary testing for the customer’s applications and 
products using NXP Semiconductors products in order to 
avoid a default of the applications and the products or of 
the application or use by customer’s third party 
customer(s). NXP does not accept any liability in this 
respect.

Summary of Contents for BGD712

Page 1: ...DATA SHEET Product specification Supersedes data of 2001 Oct 29 2001 Nov 02 DISCRETE SEMICONDUCTORS BGD712 750 MHz 18 5 dB gain power doubler amplifier dbook halfpage M3D252 ...

Page 2: ...ckage operating with a voltage supply of 24 V DC PINNING SOT115J PIN DESCRIPTION 1 input 2 3 common 5 VB 7 8 common 9 output handbook halfpage 7 8 9 2 3 5 1 Side view MSA319 Fig 1 Simplified outline QUICK REFERENCE DATA LIMITING VALUES In accordance with the Absolute Maximum Rating System IEC 60134 SYMBOL PARAMETER CONDITIONS MIN MAX UNIT Gp power gain f 45 MHz 18 2 18 8 dB f 750 MHz 19 20 dB Itot...

Page 3: ... dB f 160 to 320 MHz 21 dB f 320 to 550 MHz 20 dB f 550 to 650 MHz 20 dB f 650 to 750 MHz 19 dB f 750 to 790 MHz 17 dB S22 output return losses f 45 to 80 MHz 23 dB f 80 to 160 MHz 23 dB f 160 to 320 MHz 20 dB f 320 to 550 MHz 20 dB f 550 to 650 MHz 19 dB f 650 to 750 MHz 19 dB f 750 to 790 MHz 17 dB S21 phase response f 50 MHz 45 45 deg CTB composite triple beat 112 channels flat Vo 44 dBmV fm 74...

Page 4: ...Vr Vo 6 dB measured at fp fq fr 738 25 MHz 5 The module normally operates at VB 24 V but is able to withstand supply transients up to 30 V CSO composite second order distortion 112 channels flat Vo 44 dBmV fm 746 5 MHz 63 dB 79 channels flat Vo 44 dBmV fm 548 5 MHz 68 dB 79 channels fm 746 5 MHz Vo 49 3 dBmV at 547 MHz note 2 62 dB d2 second order distortion note 3 74 dB Vo output voltage dim 60 d...

Page 5: ... MHz 3 Typ 4 Typ 3 handbook halfpage 200 0 400 800 600 MCD843 f MHz Xmod dB 50 60 80 90 70 56 52 44 40 48 1 2 3 4 Vo dBmV Fig 3 Cross modulation as a function of frequency under tilted conditions 1 Vo 2 Typ 3 ZS ZL 75 VB 24 V 79 channels tilt 7 3 dB 50 to 550 MHz 3 Typ 4 Typ 3 handbook halfpage 200 0 400 800 600 MCD844 f MHz CSO dB 50 60 80 90 70 56 52 44 40 48 1 2 3 4 Vo dBmV Fig 4 Composite seco...

Page 6: ...3 75 2 54 5 08 12 7 8 8 4 15 3 85 2 4 38 1 25 4 10 2 4 2 44 75 44 25 8 2 7 8 0 25 0 1 3 8 b F p 6 32 UNC y w 0 7 x S DIMENSIONS mm are the original dimensions SOT115J 0 5 10 mm scale A max D max L min E max Z max Rectangular single ended package aluminium flange 2 vertical mounting holes 2 x 6 32 UNC and 2 extra horizontal mounting holes 7 gold plated in line leads SOT115J D U1 q q2 q1 b F S A Z p...

Page 7: ...pecifications and product descriptions at any time and without notice This document supersedes and replaces all information supplied prior to the publication hereof Suitability for use NXP Semiconductors products are not designed authorized or warranted to be suitable for use in life support life critical or safety critical systems or equipment nor in applications where failure or malfunction of a...

Page 8: ...ghts patents or other industrial or intellectual property rights Export control This document as well as the item s described herein may be subject to export control regulations Export might require a prior authorization from national authorities Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this documen...

Page 9: ...s document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Customer notification This data sheet was changed to reflect the n...

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