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NXP Semiconductors

FRDM33772BTPLEVB

Featuring the MC33772B battery cell controller IC

FRDM33772BTPLEVBUG

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2018. All rights reserved.

User guide

Rev. 1.0 — 22 June 2018

15 / 17

10 Legal information

10.1  Definitions

Draft

 — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

10.2  Disclaimers

Limited warranty and liability

 — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not

give any representations or warranties, expressed or implied, as to the

accuracy or completeness of such information and shall have no liability

for the consequences of use of such information. NXP Semiconductors

takes no responsibility for the content in this document if provided by an

information source outside of NXP Semiconductors. In no event shall NXP

Semiconductors be liable for any indirect, incidental, punitive, special or

consequential damages (including - without limitation - lost profits, lost

savings, business interruption, costs related to the removal or replacement

of any products or rework charges) whether or not such damages are based

on tort (including negligence), warranty, breach of contract or any other

legal theory. Notwithstanding any damages that customer might incur for

any reason whatsoever, NXP Semiconductors’ aggregate and cumulative

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in accordance with the Terms and conditions of commercial sale of NXP

Semiconductors.

Right to make changes

 — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Applications

 — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes

no representation or warranty that such applications will be suitable

for the specified use without further testing or modification. Customers

are responsible for the design and operation of their applications and

products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications

and products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with

their applications and products. NXP Semiconductors does not accept any

liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

responsible for doing all necessary testing for the customer’s applications

and products using NXP Semiconductors products in order to avoid a

default of the applications and the products or of the application or use by

customer’s third party customer(s). NXP does not accept any liability in this

respect.

Export control

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may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Safety of high-voltage evaluation products

 — The non-insulated high

voltages that are present when operating this product, constitute a risk of

electric shock, personal injury, death and/or ignition of fire. This product is

intended for evaluation purposes only. It shall be operated in a designated

test area by personnel that is qualified according to local requirements

and labor laws to work with non-insulated mains voltages and high-voltage

circuits. The product does not comply with IEC 60950 based national or

regional safety standards. NXP Semiconductors does not accept any liability

for damages incurred due to inappropriate use of this product or related to

non-insulated high voltages. Any use of this product is at customer’s own

risk and liability. The customer shall fully indemnify and hold harmless NXP

Semiconductors from any liability, damages and claims resulting from the

use of the product.

Translations

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reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Suitability for use in automotive applications

 — The use of this NXP

Semiconductors product is restricted to automotive applications only. It has

not been fully qualified for use in automotive applications. The customer

of this NXP Semiconductors product therefore understands and accepts

that: The Customer shall only use this NXP Semiconductors product for

automotive applications. This product was not originally designed for

automotive use. It will therefore, not be possible to achieve the levels of

quality and failure analysis that are normally associated with products

explicitly designed for automotive use. With respect to test-coverage, this

product is not fully compliant to AEC-Q100. All product manufacturing

locations are certified according to ISO/TS16949. Unless otherwise agreed

in writing, the product is not designed, authorized or warranted to be suitable

for use in life support, life-critical or safety-critical systems or equipment,

nor in applications where failure or malfunction of an NXP Semiconductors

product can reasonably be expected to result in personal injury, death or

severe property or environmental damage. NXP Semiconductors and its

suppliers accept no liability for inclusion and/or use of NXP Semiconductors

products in such equipment or applications and therefore such inclusion and/

or use is at the customer's own risk.

10.3  Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

Summary of Contents for FRDM33772BTPLEVB

Page 1: ...FRDM33772BTPLEVB Featuring the MC33772B battery cell controller IC Rev 1 0 22 June 2018 User guide 1 FRDM33772BTPLEVB...

Page 2: ...es and technical support services Should this evaluation kit not meet the specifications indicated in the kit it may be returned within 30 days from the date of delivery and will be replaced by a new...

Page 3: ...com FRDM33772BTPLEVB 2 On the Overview tab locate the Jump To navigation feature on the left side of the window 3 Select the Get Started link 4 Review each entry in the Get Started section 5 Download...

Page 4: ...information is digitally transmitted to a microcontroller for processing The evaluation board can be used in conjunction with a transceiver physical layer transformer driver MC33664 to convert MCU SPI...

Page 5: ...V transient 3 to 6 cells management 0 8 mV total cell voltage measurement error Isolated 2 0 Mbps differential communication or 4 0 Mbps SPI Addressable on initialization Synchronized cell voltage cu...

Page 6: ...igure 3 Figure 3 VCOM LED The VCOM LED indicates when the device is in normal mode Upon reset the MC33772B enters into normal mode VCOM turns on If there is no activity on the bus after a timeout peri...

Page 7: ...gnal name Description RTDX_IN_N SI RDTX_IN RTDX_IN_P SCLK RTDX_IN RTDX_OUT_N RTDX_OUT RTDX_OUT_P RTDX_OUT Measures the isolated pulse communication FAULT FAULT Measures the fault detection sent by the...

Page 8: ...put with external LPF resistor Cell balance 4 3 common Terminate to cell 4 and 3 common pin X1 27 X1 28 CT_2 CB_3 CB_2 Cell pin 2 input with external LPF resistor Cell balance driver Terminate to cell...

Page 9: ...VB supports current sense function with off board shunt resistor The off board shunt resistor shall be connected between X1 31 IS_P and X1 32 IS_N On board current sensing filter and protection circui...

Page 10: ...Configuring the hardware 6 1 Battery stack connection A minimum of 3 cells and a maximum of 6 cells can be monitored NXP provides a 6 cell battery emulator board BATT 6EMULATOR This board provides an...

Page 11: ...ev 1 0 22 June 2018 11 17 Figure 7 Battery stack connection 6 2 Jumper connection One hand soldered jumper JP11 on the EVB is used to set the GPIO0 pin input In position 1 2 default the NTC NTC0 is co...

Page 12: ...eserved User guide Rev 1 0 22 June 2018 12 17 6 3 TPL communication connection In a high voltage Isolated application with a daisy chain configuration up to 15 FRDM33772BTPLEVB boards may be connected...

Page 13: ...in Table 5 Table 5 Off board NTC configuration Remove Short Short Connect off board NTC between NTC0 NTC0 JP28 JP29 J9 1 2 NTC1 NTC1 JP26 JP27 J9 3 4 NTC2 NTC2 JP24 JP25 J9 5 6 NTC3 NTC3 JP22 JP23 J9...

Page 14: ...der battery pack emulator kit with shunt for current sense FRDM33664BEVB EVB for MC33664ATL Isolated Network High Speed Transceiver 8 References 1 Board summary page nxp com FRDM33772BTPLEVB 2 Product...

Page 15: ...iability related to any default damage costs or problem which is based on any weakness or default in the customer s applications or products or the application or use by customer s third party custome...

Page 16: ...6 17 Tables Tab 1 MC33772B device features 5 Tab 2 Board description 6 Tab 3 Test points 7 Tab 4 Cell connector X1 8 Tab 5 Off board NTC configuration 13 Tab 6 Bill of materials 14 Tab 7 Revision hist...

Page 17: ...Kit contents packing list 3 3 2 Required equipment 3 4 Getting to know the hardware 3 4 1 Board overview 3 4 2 Board features 4 4 3 Block diagram 4 4 4 Device features 5 4 5 Board description 5 4 6 V...

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