NXP Semiconductors
IMXRT500HDG
i.MX RT500 Hardware Design Guide
Signal
Description
Recommendations
RESETN
External reset input: A
low on this pin resets the
device, causing I/O ports and
peripherals to take on their
default states, and the boot
code to execute. Wakes up the
part from deep power-down
mode.
When used with a PMIC, tie
this pin to the
SYSRSTb
or
POWER_OK
pin with a 100
Kohm external pull-up to
VDD_
AO1V8
.
When used with the internal
VDDCORE LDO
enabled, this
pin should have a 100 Kohm
external pull-up to
VDD_AO1V8
.
Add a 10 nF capacitor for
debounce if used with a switch.
This pin has an analog filter
that suppresses glitches from 8
ns to 20 ns wide.
Table 14. Reset pin
7 Layout recommendations
This section provides the details about the layout of i.MX RT500.
7.1 Basic PCB design recommendations
The i.MX RT500 microcontroller is available in two small BGA packages.
•
The 249 terminal Fan-Out Wafer-Level Package (FOWLP) package (7.0 mm x 7.0 mm
x 0.725 mm, 0.4 mm pitch).
•
The 141 terminal Wafer-Level Chip-Scale Package (WLCSP) package (4.525 mm x
4.525 mm x 0.49 mm, 0.35 mm pitch).
For other dimensions and detailed package information, see
i.MX RT500 Low-Power
Crossover Processor Data Sheet with Addendum
(document
High Density Interconnect (HDI) design methods are expected to be used with the 249
FOWLP and 141 WLCSP packages. The MIXMRT595-EVK board uses HDI techniques
for the MCU (MIMXRT595SFFOC), as well as the PMIC (PCA9420UK), and audio amps
(TFA9896UK) which are in narrow pitch BGA packages.
High-density interconnection methods include the use of smaller vias (microvias) that
only connect two or three layers, unlike the through-hole vias of conventional PCB
design. Conventional PCB design interconnection (through-hole vias) can be used with
HDI.
7.2 Stack-up recommendations
High-speed design requires a proper PCB stack-up to ensure impedance control for
critical interfaces and to minimize EMC effects. Impedance control depends on several
factors, such as the trace width and space, associated dielectric and copper thicknesses,
and required impedance. High-speed signals must have reference planes on an adjacent
layer to provide constant impedance.
The recommended stack-up for each package is six or more layers, see
. The
MIXMRT595-EVK uses six layers with the 7 mm square Fan-Out FOWLP package.
IMXRT500HDG
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User guide
Rev. 0 — 15 November 2022
26 / 48
