NXP Semiconductors
IMXRT500HDG
i.MX RT500 Hardware Design Guide
•
L1 - Contains signals and components, high-speed signal routing, and routed power
traces.
•
L2 - It is a solid ground plane that is a reference that provides the return paths for L1
and L3 signals.
•
L3 - Contains high-speed signals, routed power, and ground.
L 1 - Signals and components
High-speed signal routing
Routed power
L2 - Solid ground plane
Reference for L 1 and L3
L3- Signals
High-speed signal routing
Routed power
L 1 signals are tightly coupled to L2 ground plane
L3 signals are tightly coupled to L2 ground plane
4
.0
m
ils
2
.7
m
ils
Figure 15. Top 3 Layers of PCB
7.4 EVK stack-up comments, bottom 3 layers
demonstrates the coupling of the bottom 3 PCB layers. L4 and L6 are tightly
coupled to the ground plane on L5.
•
L4 - Contains the main power domains and ground.
•
L5 - It is a solid ground plane that is a reference that provides the return paths for L6
signals.
The thin dielectric between L4 and L5 creates board capacitance between the power
domains and ground. This additional capacitance helps reduce the power domain
impedance.
•
L6 - Contains high-speed and low-speed signals, routed power, and components.
4
.0
m
ils
2
.7
m
ils
L4 - Power and ground
L5 - Solid ground plane
Reference for L4 and L6
L6 - Signals and components
Some high-speed routing
Routed power
Power domains are tightly coupled to L5 ground plane.
Plane on plane with thin dielectric creates capacitance to reduce power domain impedance.
L6 signals are tightly coupled to L5 ground plane.
Figure 16. Bottom 3 layers of PCB
IMXRT500HDG
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User guide
Rev. 0 — 15 November 2022
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