NXP Semiconductors
UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
1 Important notice
IMPORTANT NOTICE
For engineering development or evaluation purposes only
NXP provides the product under the following conditions:
This evaluation kit is for use of ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered
to a printed-circuit board to make it easier to access inputs, outputs and
supply terminals. This evaluation board may be used with any development
system or other source of I/O signals by connecting it to the host MCU
computer board via off-the-shelf cables. This evaluation board is not
a Reference Design and is not intended to represent a final design
recommendation for any particular application. Final device in an application
heavily depends on proper printed-circuit board layout and heat sinking
design as well as attention to supply filtering, transient suppression, and I/O
signal quality.
The product provided may not be complete in terms of required design,
marketing, and or manufacturing related protective considerations, including
product safety measures typically found in the end device incorporating the
product. Due to the open construction of the product, it is the responsibility of
the user to take all appropriate precautions for electric discharge. In order to
minimize risks associated with the customers’ applications, adequate design
and operating safeguards must be provided by the customer to minimize
inherent or procedural hazards. For any safety concerns, contact NXP sales
and technical support services.
UM11777
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2022. All rights reserved.
User manual
Rev. 1 — 6 May 2022
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