NXP Semiconductors
UM11777
FRDMGD3160HB8EVM half-bridge evaluation board
Name
Test Point
Definition
Low-voltage domain
GND
TP2
grounding point for low-voltage domain
VSUP
TP26
DC voltage source connection point for VSUP power input of GD3160 devices; typically
supplied by vehicle b12 V DC
Low-side driver domain
COLL
J90
collector test point/connection low side
DSTL
TP10
V
CE
desaturation test point connected to high-side driver DESAT pin and circuitry
GL
TP5
module gate test point on low-side driver domain which is the charging pin of gate; including
MMCX probe connection
GND
TP13,
TP16, TP27
grounding point for low-side driver domain
GNDL
TP3, TP7
grounding point for isolated low-side driver grounding plane
TSNSL
TP8
test point connection to low-side gate drive TSENSE pin
VCCL
TP1
positive voltage supply test point for isolated circuitry and low-side driver domain
VEEL
TP4
negative voltage supply test point for low-side driver gate of IGBT or SiC module
VRFL
TP9
5.0 V reference test point for isolated analog circuitry on low-side driver
High-side driver domain
AMXH
TP23
high-side driver test point for analog MUX input
COLH
J101
collector test point/connection high side
DSTH
TP25
V
CE
desaturation test point connected to high-side driver DESAT pin and circuitry
GH
TP28
module gate test point on high-side driver domain which is the charging pin of gate; including
MMCX probe connection
GNDH
TP31, TP32 grounding point for isolated high-side driver grounding plane
TSNSH
TP21
test point connection to high-side gate drive TSENSE pin
VCCH
TP29
positive voltage supply test point for isolated circuitry and high-side driver domain
VEEH
TP30
negative voltage supply test point for high-side driver gate of IGBT or SiC module
VRFH
TP22
5.0 V reference test point for isolated analog circuitry on high-side driver
Table 3. Test point definitions
UM11777
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User manual
Rev. 1 — 6 May 2022
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