Operating & Maintaining the Eden 3-D Printer
7–46
DOC-00500 Rev. F
Summary
This
area,
on
the
right
side
of
the
screen,
displays
the
combined
results
of
all
the
tests
run,
using
the
symbols
used
in
the
Status
column:
Test Descriptions
and
Troubleshooting
The
following
table
lists
the
name
of
each
test
in
the
Built
‐
in
Tests
suite,
together
with
its
description
and
a
possible
reason
for
its
failure.
If
you
need
assistance,
contact
your
Object
service
provider.
All
tests
successfully
completed.
At
least
one
test
failed.
Not
all
tests
performed.
Test Name
Description
Possible Reason for Failure
Sub
‐
System
Communication
Tests
communications
between
Eden
components.
Disconnected
communications
cable.
Faulty
cable.
FIFO
Non
‐
Interrupt/
FIFO
Interrupt
Tests
the
data
queue
in
the
DATA
PCI
card.
Faulty
DATA_PCI
card.
Encoder
Tests
the
encoder
ʹ
s
reliability
by
comparing
readings
from
multiple
runs
along
the
X
‐
axis.
Faulty
encoder.
System
Info
Compares
the
following
parameter
values
with
the
minimum
requirements.
•
Physical
memory
•
Available
memory
•
Free
space
on
disk
•
Monitor
resolution
Failure
of
RAM
memory
allocation
in
the
Eden
computer.
Block
Filling
Analyzes
the
thermistor
readings
when
the
block
is
full
and
when
it
is
empty.
Faulty
thermistor.
Interlock
Tests
the
interlock
in
the
printer
cover.
Failure
of
interlock
mechanism.
Faulty
latch.
Disconnected
cables.
Cabin
Temperature
Tests
the
temperature
level
in
the
build
‐
tray
area.
Faulty
temperature
sensor
(OHDB).
Head
EEPROM
Tests
the
read/write
capabilities
of
the
‐
head
driver
cards.
Faulty
‐
head
driver
card.
Head
Voltage
Checks
the
control
of
voltages
supplied
to
the
heads.
Faulty
‐
head
driver
card.
Tray
Heater
Not
used
for
this
printer
—
