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Octagon has never found a single case where multiple IC
failures were not caused by misuse or accident.  It is very
probable that multiple component failures indicate that they
were user-induced.

Testing “dead” cards - For a card that is “completely
nonfunctional”, there is a simple test to determine accidental
over voltage, reverse voltage or other “forced” current
situations.  Unplug the card from the bus and remove all
cables.  Using an ordinary digital ohmmeter on the 2,000 ohm
scale, measure the resistance between power and ground.
Record this number.  Reverse the ohmmeter leads and
measure the resistance again. If the ratio of the resistances is
2:1 or greater, fault conditions most likely have occurred.  A
common cause is miswiring the power supply.

Improper power causes catastrophic failure - If a card
has had reverse polarity or high voltage applied, replacing a
failed component is not an adequate fix.  Other components
probably have been partially damaged or a failure mechanism
has been induced.  Therefore, a failure will probably occur in
the future.  For such cards, Octagon highly recommends that
these cards be replaced.

Other over-voltage symptoms - In over-voltage situations,
the programmable logic devices, EPROMs and CPU chips,
usually fail in this order. The failed device may be hot to the
touch.  It is usually the case that only one IC will be
overheated at a time.

Power sequencing - The major failure of I/O chips is caused
by the external application of input voltage while the Micro PC
power is off.  If you apply 5V to the input of a TTL chip with
the power off, nothing will happen.  Applying a 5V input to a
CMOS card will cause the current to flow through the input
and out the 5V power pin.  This current attempts to power up
the card.  Most inputs are rated at 25 mA maximum.  When
this is exceeded, the chip may be damaged.

Failure on power-up - Even when there is not enough
current to destroy an input described above, the chip may be
destroyed when the power to the card is applied.  This is due
to the fact that the input current biases the IC so that it acts
as a forward biased diode on power-up.  This type of failure is
typical on serial interface chips.

Summary of Contents for 5420

Page 1: ...tracting zip file located at the Octagon Systems web site on the product specific page Download this file to a separate directory on your hard drive then double click on it to extract the files All references in this manual to files and directories on the CD now refer to files in the Utilities zip file ...

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Page 24: ...responding Flat Panel Signal Names Flat Panel Connector J1 Pin Function Mono Single Panel Mono Dual Panel Color TFT 4 bit Color STN 4 bit Pack Color STN Extended 4 bit Pack Color STN DD 16 bit 13 PNL0 P0 UD3 B0 B2 R0 G0 UG1 15 PNL1 P1 UD2 BI R3 B0 R1 UB1 17 PNL2 P2 UD1 B2 G3 G1 B1 UR2 19 PNL3 P3 UD0 B3 B3 R2 G2 UG2 26 PNL4 P4 LD3 G4 R4 B2 R3 LG1 28 PNL5 P5 LD2 G5 G4 G3 B3 LB1 30 PNL6 P6 LD1 G6 B4 ...

Page 25: ...r J1 Pin Function Mono Single Panel Mono Dual Panel Color TFT 4 bit Color STN 4 bit Pack Color STN Extended 4 bit Pack Color STN DD 16 bit 34 PNL8 UD7 R0 UR0 36 PNL9 UD6 G0 UG0 38 PNL10 UD5 B0 UB0 40 PNL11 UD4 R1 UR1 42 PNL12 LD7 G1 LR0 44 PNL13 LD6 B1 LG0 46 PNL14 LD5 R2 LB0 48 PNL15 LD4 G2 LR1 45 P8 R0 SHFCLKU 47 P9 R1 49 P10 R2 50 P11 R3 ...

Page 26: ...unction Mono Single Panel Mono Dual Panel Color TFT 4 bit Color STN 4 bit Pack Color STN Extended 4 bit Pack Color STN DD 16 bit 9 SHFCLK CL2 CL2 CL2 CL2 SHFCLKL CL2 1 ACDCLK M M M M M M 3 FLM FLM FLM FLM FLM FLM FLM 5 LP LP LP LP LP LP LP 7 BLANK DE 20 21 5V 24 25 VEE 22 23 VEE OPTION 2 4 6 8 10 GND 12 14 16 18 GND 27 29 31 33 35 GND 37 39 41 43 GND ...

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