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DMTA-10045-01EN, Rev. E, August 2016

Overview of the BondMaster 600

37

Figure 2

‑

12 Installing the microSD card

3.

Hold the card so that the microSD label faces toward the rear of the
BondMaster 600.

4.

Gently slide the card into the microSD slot until it clicks.

To remove the microSD card, gently push the card into the BondMaster 600 and
release. A spring-loaded mechanism will partially eject the card, and then you can
grasp the card and remove it from the BondMaster 600.

2.5

BondMaster 600 Hardware Features

The BondMaster 600 has many physical features that are either completely new or
improved features from the previous BondMaster 1000e+ model. It is important to
become familiar with the use and maintenance of these items.

USB port

Thumb screws

(two)

microSD card slot

NOTE

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Summary of Contents for BondMaster 600

Page 1: ...s Manual This instruction manual contains essential information on how to use this Olympus product safely and effectively Before using this product thoroughly review this instruction manual Use the product as instructed Keep this instruction manual in a safe accessible location ...

Page 2: ...ontained therein and corresponds to the version of the product manufactured prior to the date appearing on the title page There could however be some differences between the manual and the product if the product was modified thereafter The information contained in this document is subject to change without notice Part number DMTA 10045 01EN Rev E August 2016 Printed in the United States of America...

Page 3: ...atibility 6 Repair and Modification 6 Safety Symbols 7 Safety Signal Words 7 Note Signal Words 8 Safety 9 Warnings 9 Battery Precautions 10 Hearing Protection 11 Equipment Disposal 11 CE European Community 12 WEEE Directive 12 China RoHS 12 Korea Communications Commission KCC 13 EMC Directive Compliance 14 FCC USA Compliance 14 ICES 001 Canada Compliance 14 Warranty Information 15 Technical Suppor...

Page 4: ...PROBE Connector 45 2 5 2 2 Input Output and VGA OUT Connectors 46 2 5 2 3 MicroSD and USB Port 47 2 5 3 Various Hardware Features 48 2 5 3 1 BondMaster 600 Stand 49 2 5 3 2 O Ring Gasket and Membrane Seals 49 2 5 3 3 Display Protection 50 2 5 4 Environmental Ratings 50 3 Software User Interface 51 3 1 Starting Up the BondMaster 600 51 3 1 1 Navigating the Application Menu 53 3 1 2 Main Inspection ...

Page 5: ...Swept Mode MAIN Menu 78 5 3 3 MIA Mode MAIN Menu 81 5 3 4 RESON Mode MAIN Menu 83 5 3 5 PC RF Mode DISP DOTS Menu 84 5 3 6 PC Swept Mode DISP DOTS Menu 90 5 3 7 MIA Mode DISP DOTS Menu 91 5 3 8 RESON Mode DISP DOTS Menu 92 5 3 9 PC RF Mode ALARM Menu in RF RUN 93 5 3 10 PC RF Mode ALARM Menu in RF XY and XY RUN 96 5 3 11 PC RF Mode ALARM Menu in XY SCAN and XY RUN 96 5 3 12 PC Swept Mode ALARM Men...

Page 6: ...hnique 153 6 2 Advanced Guide for OEM Procedure and Application Development Using the BondMaster 600 160 6 2 1 Analyzing Frequency Response in Honeycomb Composite Selecting the Best Inspection Frequency Using PC Swept Technique 160 6 2 2 Finding the Best Frequency to Inspect Honeycomb Composite Mechanical Impedance Analysis MIA Technique 166 7 BondMaster PC Software 173 7 1 USB Communication 173 7...

Page 7: ...Mechanical Impedance Analysis and Resonance Mode Specifications 216 A 6 Alarms Connectivity and Memory Specifications 217 A 7 Interface Specifications 218 Appendix B Accessories Replacement Parts and Upgrades 221 List of Figures 225 List of Tables 231 Index 233 ...

Page 8: ...DMTA 10045 01EN Rev E August 2016 Table of Contents viii ...

Page 9: ...te I O input output ID identification IP ingress protection LCD liquid crystal display LED light emitting diode Li ion lithium ion MIA mechanical impedance analysis N A not applicable OEM original equipment manufacturer P N part number PC personal computer PC pitch catch SD secure digital card SPC statistical process control USB universal serial bus VAC volts alternating current VGA video graphics...

Page 10: ...DMTA 10045 01EN Rev E August 2016 List of Abbreviations x ...

Page 11: ...ymbols are attached to the instrument at the locations shown in Figure i 1 on page 1 and Figure i 2 on page 2 If any or all of the labels or symbols are missing or illegible please contact Olympus Figure i 1 Label attached to the back of the instrument Instruction and rating label see Table 1 on page 3 ...

Page 12: ...c shock do not touch the inner conductors of the 11 pin Fischer connector Up to 80 V can be present on the inner conductors The warning symbol shown in the figure below warns of this electric shock risk Figure i 3 The warning symbol Serial number location see Table 2 on page 4 CAUTION 11 pin Fischer connector Warning symbol ...

Page 13: ...hould be collected separately The regulatory compliance mark RCM label indicates that the product complies with all applicable standards and has been registered with the Australian Communications and Media Authority ACMA for placement on the Australian market Seller and user shall be noticed that this equipment is suitable for electromagnetic equipment for office work class A and it can be used ou...

Page 14: ...of years for which listed controlled substances will not leak or chemically deteriorate while in the product The EFUP for the BondMaster 600 has been determined to be 15 years Note The Environment Friendly Use Period EFUP is not meant to be interpreted as the period assuring functionality and product performance The warning symbol indicates that the user must read the user s manual in order to fin...

Page 15: ...cial materials Do not use the BondMaster 600 for any purpose other than its intended use It must never be used to inspect or examine human or animal body parts Instruction Manual This instruction manual contains essential information on how to use this Olympus product safely and effectively Before using this product thoroughly review this instruction manual Use the product as instructed Keep this ...

Page 16: ...on battery pack Olympus P N 600 BAT L 2 U8760058 Optional stand alone external battery charger Olympus P N EPXT EC X where X denotes the power cord type see Table 18 on page 222 Charger adaptor Olympus P N EP MCA X where X denotes the power cord type see Table 18 on page 222 Always use equipment and accessories that meet Olympus specifications Using incompatible equipment could cause equipment mal...

Page 17: ...d possible harm or material damage Shock hazard caution symbol This symbol is used to alert the user to potential electric shock hazards All safety messages that follow this symbol shall be obeyed to avoid possible harm Safety Signal Words The following safety symbols might appear in the documentation of the instrument The DANGER signal word indicates an imminently hazardous situation It calls att...

Page 18: ...duct destruction of part or all of the product or loss of data Do not proceed beyond a CAUTION signal word until the indicated conditions are fully understood and met Note Signal Words The following safety symbols could appear in the documentation of the instrument The IMPORTANT signal word calls attention to a note that provides important information or information essential to the completion of ...

Page 19: ...instrument and in this instruction manual If the equipment is used in a manner not specified by the manufacturer the protection provided by the equipment could be impaired Do not install substitute parts or perform any unauthorized modification to the instrument Service instructions when applicable are for trained service personnel To avoid the risk of electric shock do not perform any work on the...

Page 20: ...d down in these regulations thus contributing to worldwide harmonization in this field These international organizations include the International Civil Aviation organization ICAO the International Air Transport Association IATA the International Maritime Organization IMO the US Department of Transportation USDOT Transport Canada TC and others Please contact the transporter and confirm current reg...

Page 21: ...umerous factors including but not limited to part composition frequency extent of defect s and proximity to the part being tested Under specific test conditions sound levels in excess of 85 dB have been measured near the probe Sounds of this intensity can result in hearing fatigue and possible hearing damage after long term exposure and therefore a hearing protection program may be necessary In pa...

Page 22: ... indicates compliance with the above directives In accordance with European Directive 2012 19 EU on Waste Electrical and Electronic Equipment WEEE this symbol indicates that the product must not be disposed of as unsorted municipal waste but should be collected separately Refer to your local Olympus distributor for return and or collection systems available in your country The China RoHS mark indi...

Page 23: ... 목적으로 합니다 电气电子产品有害物质限制使用标识中国 RoHS 标识是根据电器电子产品有害物质限制使用管理办法以及电子电气产品有害物质限制使用标识要求的规定适用于在中国销售的电气电子产品上的电气电子产品有害物质限制使用标识注意电气电子产品有害物质限制使用标识内的数字为在正常的使用条件下有害物质不会泄漏的年限不是保证产品功能性的年限产品中有害物质的名称及含量有害物质部件名称铅及其化合物汞及其化合物镉及其化合物六价铬及其化合物多溴联苯多溴二苯醚 Pb Hg Cd Cr Ⅵ PBB PBDE 机构部件主体光学部件电气部件附件本表格依据 SJ T 11364 的规定编制表示该有害物质在该部件所有均质材料中的含量均在 GB T26572 规定的限量要求以下表示该有害物质至少在该部件的某一均质材料中的含量超出 GB T2657...

Page 24: ...cations not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to Part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial envi...

Page 25: ... equipment replacement if necessary This instruction manual explains the proper operation of your Olympus product The information contained herein is intended solely as a teaching aid and shall not be used in any particular application without independent testing and or verification by the operator or the supervisor Such independent verification of procedures becomes increasingly important as the ...

Page 26: ...DMTA 10045 01EN Rev E August 2016 Important Information Please Read Before Use 16 ...

Page 27: ...he Olympus BondMaster 600 composite bond tester which uses acoustic and ultrasonic waves to detect surface flaws in various types of composite materials see Figure i 4 on page 17 The manual s information is organized to explain the BondMaster 600 technology safety details hardware and software Figure i 4 BondMaster 600 ...

Page 28: ...DMTA 10045 01EN Rev E August 2016 Introduction 18 ...

Page 29: ...be inspected for any signs of damage that may have occurred during shipment If damage is noted contact the carrier and retain the damaged shipping materials until an inspection can be performed by a representative of the carrier With the exception of the universal battery charger adaptor and external accessories all BondMaster 600 options are installed before the instrument is shipped Check the co...

Page 30: ...g Started Guide Olympus P N DMTA 10044 01XX where XX denotes the language see Table 20 on page 222 for order numbers BondMaster 600 User s Manual and PC interface program on CD ROM Olympus P N B600 CD U8141002 MicroSD Memory Card 2 GB Olympus P N MICROSD ADP 2GB U8779307 USB communication cable Olympus P N EPLTC C USB A 6 U8840031 600 Series rechargeable Li ion battery 10 8 V 6 8 Ah 73 Wh Olympus ...

Page 31: ...can be found in Accessories Replacement Parts and Upgrades on page 221 Charger adaptor AC power cord and probe cable Getting Started leaflet and calibration certificate BondMaster 600 Transport case may differ from your model BondMaster 600 User s Manual and PC interface program on CD ROM Li ion battery microSD memory card and USB to PC cable ...

Page 32: ...DMTA 10045 01EN Rev E August 2016 Chapter 1 22 ...

Page 33: ...d for specific applications The BondMaster 600 is a very lightweight and portable instrument and it can operate using either an internal battery or an alternating current power source from 90 V to 240 V with a frequency of 50 Hz or 60 Hz In all of the various test modes in which the BondMaster 600 operates using a range of probes the alternating electric current causes oscillations in the piezoele...

Page 34: ... through a semi elastic material As a result the receiving crystal becomes more or less restricted as the mechanical impedance of the test specimen changes If a defect is present the probe tip oscillates more freely and the receiving crystal is subjected to a lower alternating mechanical pressure which generates a weaker amplitude voltage that is detected by the instrument However if the test spec...

Page 35: ...tal disbonds and interply delaminations In carbon fiber or fiberglass composites the location of the defect can often be estimated using the phase deflection on the instrument screen 2 2 Connectors Figure 2 1 on page 25 illustrates the connections of the BondMaster 600 with the charger adaptor the microSD card and a personal computer PC Figure 2 1 The BondMaster 600 connections To power outlet DC ...

Page 36: ...6 Figure 2 2 The top end connectors Do not allow metallic or foreign objects to enter the device through connectors or any other openings Otherwise an electric shock or malfunction may result To avoid the risk of an electric shock do not touch the inner conductors of the PROBE connector Up to 80 V can be present The USB port and the removable microSD memory card slot are located on the right hand ...

Page 37: ... 27 Figure 2 3 The connectors behind the I O door The I O and the VGA OUT connectors are located at the back of the BondMaster 600 in the upper section see Figure 2 4 on page 28 A rubber cover protects each connector USB port microSD card slot I O door microSD card ...

Page 38: ...er supply methods Directly from the BondMaster 600 charger adaptor Internal lithium ion battery Internal alkaline battery holder Press the power button to turn on the BondMaster 600 see Figure 2 5 on page 29 Pressing this button once causes an initial beep followed by the startup screen and a second beep approximately five seconds later VGA OUT connector I O connector ...

Page 39: ...rge the lithium ion rechargeable battery when installed in the BondMaster 600 A charger adaptor indicator light on the front panel of the instrument displays the current status of the charger adaptor see Figure 2 5 on page 29 and Figure 2 6 on page 29 Figure 2 6 The charger adaptor indicator light on the front panel Use only the power cord supplied with your BondMaster 600 unless specifically inst...

Page 40: ...oing so might cause an explosion or injury Do not attempt to power or charge other electronic equipment with the charger adaptor P N EP MCA X unless specifically instructed in the manual Misuse of the charger adaptor can cause other batteries and or instruments to explode which could lead to serious injury or death To connect the charger adaptor 1 Connect the AC power cord to the charger adaptor a...

Page 41: ...adaptor to the DC power connector on top of the BondMaster 600 see Figure 2 8 on page 31 Figure 2 8 Connecting the DC power cable Table 3 on page 32 explains the indicators for the power status of the charger adaptor and the battery charge condition which are visible at the top of the front panel and in the user interface DC power cable from the charger adaptor DC power connector rubber seal not s...

Page 42: ...so has a small hole in the bottom center area that is covered on the inside by an environmentally sealed membrane vent This vent is a safety feature that is required in the event that the BondMaster 600 battery fails and emits gas This vent must not be punctured Table 3 Charger adaptor and battery indicators Charger adaptor indicator light AC line power connected Indicator meaning Battery indicato...

Page 43: ... external charging base Olympus P N EPXT EC X You can also use the BondMaster 600 with eight standard AA size alkaline batteries installed in a battery holder Olympus P N 600 BAT AA U8780295 for extended portable use If the BondMaster 600 is to be used with a rechargeable battery only use the Olympus battery P N 600 BAT L 2 U8760058 Using any other type of battery might cause an explosion and inju...

Page 44: ...shipped You must charge the battery for two to three hours before using battery power to operate the BondMaster 600 see Charger Adaptor on page 29 To install or replace the lithium ion battery 1 Unfold the BondMaster 600 stand see Figure 2 10 on page 35 2 At the back of the BondMaster 600 loosen the two thumb screws securing the battery compartment cover 3 Remove the battery compartment cover 4 Re...

Page 45: ...us operation To install the alkaline battery holder 1 Unfold the BondMaster 600 stand see Figure 2 11 on page 36 2 Loosen the two thumb screws securing the battery compartment cover at the back of the BondMaster 600 and then remove the battery compartment cover 3 Remove the lithium ion battery if installed 4 Install eight AA size alkaline batteries into the alkaline battery holder 5 Connect the al...

Page 46: ...ed in the alkaline battery holder 2 4 MicroSD Card Installation A 2 GB microSD card Olympus P N MICROSD ADP 2GB U8779307 can be installed in the BondMaster 600 To install the microSD removable memory card 1 Remove the card from its packaging 2 Loosen the two thumb screws and then open the BondMaster 600 I O door see Figure 2 12 on page 37 Battery holder with alkaline batteries eight Battery holder...

Page 47: ...ently push the card into the BondMaster 600 and release A spring loaded mechanism will partially eject the card and then you can grasp the card and remove it from the BondMaster 600 2 5 BondMaster 600 Hardware Features The BondMaster 600 has many physical features that are either completely new or improved features from the previous BondMaster 1000e model It is important to become familiar with th...

Page 48: ...igure 2 13 on page 38 and Figure 2 14 on page 39 show the main components on the BondMaster 600 Figure 2 13 Overview of the BondMaster 600 Front view Protective rubber bumpers D rings to attach the optional chest harness at the four corners Display window screen Keypad Knob ...

Page 49: ... knob is also used to refer to the SmartKnob The keypad on the BondMaster 600 front panel contains keys that are grouped around the display also named screen The keys are used in combination with the SmartKnob to provide direct access to menus and common parameters and to enable easy adjustment of values see Figure 2 15 on page 40 DC power connector VGA OUT connector behind rubber cover Stand Batt...

Page 50: ... 19 on page 42 and Table 4 on page 43 The text labels on some keys may be replaced by pictograms depending on the keypad configuration In this document keys are referred to using the English label which indicates its function The keys are used to select menu items or screen parameters and to change parameter values Direct function keys Function keys Charger adaptor indicator Power button Display s...

Page 51: ...DMTA 10045 01EN Rev E August 2016 Overview of the BondMaster 600 41 Figure 2 16 The BondMaster 600 English keypad Figure 2 17 The BondMaster 600 international keypad ...

Page 52: ...DMTA 10045 01EN Rev E August 2016 Chapter 2 42 Figure 2 18 The BondMaster 600 Chinese keypad Figure 2 19 The BondMaster 600 Japanese keypad ...

Page 53: ...lysis modes of operation only GAIN Direct function key used to display either the BondMaster 600 combined horizontal and vertical gain settings horizontal gain only or vertical gain only ERASE Direct function key used to erase the currently displayed image RUN Direct function key used to change the RUN display mode Depending on the operation mode different displays are available NOTE changing the ...

Page 54: ...ay mode position trace grid Also allows you to add reference dots not available in PC Swept mode ALARM Provides access to the alarm menu which controls functions such as alarm type dwell time horn and alarm position MEM Provides access to the memory menu which controls functions such as previewing stored memory files recalling and editing stored files capture mode capture time and user information...

Page 55: ...tor The PROBE connector is located at the top of the BondMaster 600 on the left hand side see Figure 2 20 on page 45 Figure 2 20 Location of the PROBE connector FULL NEXT Used to expand the BondMaster 600 display to full screen or to select items in the menu A A Function key B B Function key C C Function key D D Function key E E Function key Table 4 Keypad functions continued Function name Interna...

Page 56: ... risk of an electric shock do not touch the inner conductors of the PROBE connector Up to 80 V can be present 2 5 2 2 Input Output and VGA OUT Connectors The input output I O and the VGA OUT connectors are located at the back of the BondMaster 600 in the upper section see Figure 2 21 on page 46 A rubber cover protects each connector Figure 2 21 The VGA OUT and I O connectors CAUTION VGA OUT connec...

Page 57: ...r covers the microSD slot and the USB port see Figure 2 22 on page 48 The I O door closes against an integral membrane seal to keep liquids away from the unsealed connectors behind it The BondMaster 600 utilizes 2 GB microSD memory cards for both onboard and removable memory The onboard 2 GB microSD card is mounted on the PC board inside the BondMaster 600 and is responsible for all onboard data s...

Page 58: ...ed Do not expose the BondMaster 600 to harsh and wet environments while the I O door is open To prevent connector corrosion and damage to the BondMaster 600 keep the I O door closed and sealed when no cable is connected 2 5 3 Various Hardware Features The BondMaster 600 is equipped with physical features that make it suitable for a variety of operating environments USB port Thumb screws two microS...

Page 59: ...om sliding The stand is bent in the center to easily accommodate being placed on a curved surface Figure 2 23 BondMaster 600 stand 2 5 3 2 O Ring Gasket and Membrane Seals The BondMaster 600 contains seals that protect the instrument s internal hardware from the environment Battery compartment cover seal I O door seal Membrane vent These seals must be properly maintained to assure environmental du...

Page 60: ...as adopted the IP International Protection ingress rating system to indicate how well the instrument is sealed The BondMaster 600 has been tested to the requirements of IP66 The BondMaster 600 is designed and manufactured to meet this level of ingress protection when it leaves the factory To maintain this level of protection you are responsible for the proper care of all routinely exposed membrane...

Page 61: ...ondMaster 600 label showing keypad functions 3 1 Starting Up the BondMaster 600 When power is turned on the BondMaster 600 starts up in one of two modes depending on what is connected to the instrument If no probe is connected or a probe that is not a PowerLink type of probe is connected the first screen displayed by the BondMaster 600 software is the application quick setup menu see Figure 3 2 on...

Page 62: ...connected the BondMaster 600 starts up in the PowerLink recognition screen see Figure 3 3 on page 52 which lets you automatically set up the instrument for that type of probe Figure 3 2 Application choices on the quick setup menu Figure 3 3 The PowerLink recognition screen ...

Page 63: ... Press the Enter key to select the application OR Press the Return key to go back to the BondMaster 600 main screen To navigate the application menu for PowerLink If a PowerLink probe is connected and the PowerLink recognition screen is displayed see Figure 3 3 on page 52 load the program stored in the PowerLink probe and automatically set up the BondMaster 600 by pressing the A key OR Bypass the ...

Page 64: ...r remains visible at the top of the screen except when in full screen mode see Table 3 on page 32 for details The time and date also remain visible except when in full screen mode The rectangular readout in the top left corner of the screen is named the quick access bar see Figure 3 5 on page 55 When the GAIN direct function key is pressed the quick access bar displays one of the following options...

Page 65: ... Displaying Real Time Readings on page 58 The BondMaster 600 settings are displayed on the right hand side of the main screen The displayed settings information can change depending on the menu key that is pressed 3 2 Selecting from the Menus The BondMaster 600 menu keys at the bottom of the front panel are MAIN DISP DOTS ALARM MEM and ADV SETUP When one of these keys is pressed the operation menu...

Page 66: ...which can then be adjusted 2 Select the parameter to be changed by pressing the function key A B C D or E located next to it Rotating the knob changes the parameter s value The value selected with the knob is automatically entered and saved you do not have to use the Enter key 3 3 Displaying All Parameters Simultaneously ALL SETTINGS Menu As an alternative to the operation menu the BondMaster 600 ...

Page 67: ...d return to the previous screen Because of the large number of parameters that are available on the BondMaster 600 the ALL SETTINGS menu contains multiple screens or pages The help text at the bottom of the menu provides any additional navigation options that may be needed 3 3 2 Special Functions in the ALL SETTINGS Menu Two special instrument functions are found only in the ALL SETTINGS menu EXT ...

Page 68: ...ailable choices depends on the selected operating mode The real time readings bar can be set to display one or two readings or it can be disabled The real time readings bar can display the following readings see Figure 3 7 on page 59 and Figure 3 8 on page 59 LIVE AMPL Maximum distance between current XY horizontal vertical dot position swept mode excluded and null position LIVE VERT Maximum dista...

Page 69: ...T LIVE HORZ and LIVE ANGL Figure 3 8 Example of VOLTS P P 3 4 1 Enabling Real Time Readings on the Main Inspection Screen The real time readings are enabled through the ADV SETUP menu key To enable the real time readings bar on the main inspection screen 1 Press the ADV SETUP menu key 2 Press the B key ...

Page 70: ...he real time readings are also available in full screen mode which can be accessed using the FULL NEXT key shown in Figure 3 5 on page 55 The location of displayed readings on the full screen differs from the location on the main inspection screen The location and the type of reading is user selectable Valid possible locations for the real time readings in full screen mode are TOP LEFT TOP CNTR to...

Page 71: ...Press the B key 3 Press the E key 4 Press the B key 5 Press the FULL NEXT key to navigate to the desired type and or location 6 Rotate the knob to make a selection 7 Press the FULL NEXT key to navigate to another type and or location OR Press the Return key to exit ...

Page 72: ...DMTA 10045 01EN Rev E August 2016 Chapter 3 62 ...

Page 73: ...Master 600 to present the user interface in the following languages English French Spanish German Japanese Chinese Russian Swedish Italian Portuguese Norwegian Hungarian Polish Dutch and Czech You can also change the character that represents the decimal of a number To change the user interface language and decimal symbol 1 Press the ADV SETUP menu key twice and then press the B key to access the ...

Page 74: ...decimal of numbers PERIOD or COMMA 6 Press to return to the main inspection screen 4 2 Setting the Clock The BondMaster 600 has a built in date and time clock You can set the date and the time and select their respective format The BondMaster 600 saves all inspection results with their acquisition date To set the clock 1 Press the ADV SETUP menu key twice and then press the B key to access the SYS...

Page 75: ... use the FULL NEXT key to highlight the desired parameter and then use the knob to change its value a Set BRIGHTNESS to one of the predefined brightness levels 0 25 50 75 or 100 see Changing the Display Brightness on page 65 for more details on brightness b Set VGA OUTPUT to ON or OFF c Set AUTO ERASE to ON or OFF see Adjusting Auto Erase on page 66 for details d Set APPLICATION WINDOW AT STARTUP ...

Page 76: ... or 100 3 Press to return to the main inspection screen Reducing the display BRIGHTNESS percentage increases the battery life Battery life specifications are based on backlight BRIGHTNESS set to 50 4 5 Adjusting Auto Erase You can adjust the BondMaster 600 to clear erase the screen contents automatically after the CAL NULL key is pressed By default the AUTO ERASE is set to ON but it can be disable...

Page 77: ...APPLICATION WINDOW AT STARTUP is highlighted 2 Use the knob to disable select OFF or enable select ON this function 3 Press to return to the main inspection screen 4 7 Activating the Crosshairs You can set the BondMaster 600 to display crosshairs to better highlight the position of the null see Figure 4 2 on page 68 Crosshairs are available only for XY screens with or without split screen but func...

Page 78: ...DMTA 10045 01EN Rev E August 2016 Chapter 4 68 Figure 4 2 Crosshairs and the NULL point ...

Page 79: ...mpus PowerLink BondMaster probes when they are connected to the instrument The BondMaster 600 is then configured according to the parameters programmed into the PowerLink ID chip Each PowerLink probe is programmed at the factory to provide its model number preselected operating frequency gain and serial number When a PowerLink probe is connected the BondMaster 600 displays the PowerLink recognitio...

Page 80: ...Link feature 5 2 BondMaster 600 Controls The BondMaster 600 controls are displayed in Figure 5 2 on page 70 Figure 5 2 The BondMaster 600 controls 5 2 1 Display The BondMaster 600 is configured with a color liquid crystal display LCD and offers 640 480 resolution full VGA The LCD display also referred to as a screen shows the probe signal menus status bar messages and full screen text when require...

Page 81: ...ect function keys remain functional If any locked functions are attempted the error message Parameter Locked will appear at the bottom of the screen 5 2 3 Function Keys The function keys located on the right side of the BondMaster 600 are used to select instrument parameters for adjustment When a function key is pressed the parameter located in the box displayed directly beside that key A B C D or...

Page 82: ...s menu displays all BondMaster 600 settings at the same time 5 2 5 SmartKnob This rotating knob called the SmartKnob is located in the upper left hand side of the BondMaster 600 Its primary purpose is to adjust the selected BondMaster 600 parameter When the box of the parameter being adjusted is highlighted rotating the knob clockwise increases the value and rotating it counterclockwise decreases ...

Page 83: ... depending on the following The mode of operation and The RUN function or display mode Therefore the two master controls MODE and RUN determine what is displayed on the menus 5 3 1 PC RF Mode MAIN Menu The pitch catch PC mode RF DISPLAY is similar to that of the impulse mode However the data displayed is the raw amplified signal from the probe and this data is not processed by the instrument see F...

Page 84: ...d on the PC RF main menu see Figure 5 4 on page 74 FREQ frequency RF GAIN WIDTH GATE RF DISPLAY CYCLES H V GAIN horizontal vertical gain H GAIN horizontal gain V GAIN vertical gain ANGLE REP RATE repetition rate PRB DRV probe drive LP FILTER low pass filter Figure 5 4 The PC RF main menu ...

Page 85: ...o 0 1 fine increments By default the knob adjustment is set to coarse increments and FREQ is underlined when the coarse knob function is enabled To turn the coarse knob function back on press one more time RF GAIN The RF GAIN or vertical gain setting controls the gain of the tone burst signal This is adjustable from 0 0 dB to 70 0 dB The RF GAIN is the master gain setting and it should be always b...

Page 86: ...s the E key and then rotate the knob to the desired value CYCLES The CYCLES setting is used to control the number of cycles of the signal in the tone burst in the PC RF and IMPULSE display modes and is adjustable between 1 and 10 To change the CYCLES setting press the MAIN menu key followed by the A key and then rotate the knob to the desired number of cycles H V GAIN horizontal vertical gain The ...

Page 87: ...d by the E key and then rotate the knob to the desired value REP RATE repetition rate The REP RATE repetition rate setting controls the repetition rate of the tone burst To change the REP RATE setting press the MAIN menu key followed by the C key and then rotate the knob to the desired repetition rate PRB DRV probe drive The BondMaster 600 has three levels of probe drive LOW MEDIUM and HIGH The ap...

Page 88: ...the excitation frequency that is swept see Figure 5 5 on page 78 Figure 5 5 The PC Swept display The following parameters can be adjusted on the PC Swept main menu ANGLE GAIN H V GAIN START FREQ start frequency STOP FREQ stop frequency SW RATE swept rate FRQ1 TRACK frequency 1 tracking FRQ2 TRACK frequency 2 tracking H GAIN horizontal gain V GAIN vertical gain PRB DRV probe drive for details see P...

Page 89: ... key and rotate the knob to the desired setting START FREQ start frequency The START FREQ start frequency setting controls the swept frequency starting point value To change the START FREQ setting press the C key and then rotate the knob to the desired start frequency value STOP FREQ stop frequency The STOP FREQ stop frequency setting controls the swept frequency ending point value To change the S...

Page 90: ... press the MAIN menu key followed by the B key and then rotate the knob to the desired frequency 2 tracking value This control is only available when the display is set to SPEC XY or SPECTRUM and it is easier to work with in the SPEC XY RUN To properly adjust the FRQ2 TRACK setting 1 Scan a patch of good material and adjust gain as needed to avoid signal saturation 2 Scan over the bad area and obs...

Page 91: ...ter 600 vertical gain To change the V GAIN setting the MAIN menu key followed by the D key and then rotate the knob to the desired vertical gain value 5 3 3 MIA Mode MAIN Menu In the mechanical impedance analysis MIA mode a frequency sweep with the probe on a good part is compared to the frequency sweep of the probe on a defective part This determines a suitable frequency for performing the test s...

Page 92: ...hange the FREQ setting press the A key and then rotate the knob to the desired frequency value ANGLE The ANGLE setting controls the angle of the display signal To change the ANGLE setting press the E key and then rotate the knob to the desired angle value LP FILTER low pass filter The LP FILTER low pass filter setting may be set from 1 Hz to 480 Hz plus wideband The low pass filter is adjustable i...

Page 93: ...de is selected a frequency sweep is done to determine the resonance frequency of the probe The amplitude and phase of the sweep are displayed see Figure 5 7 on page 83 Figure 5 7 The resonance display The following parameters can be adjusted on the RESON resonance MAIN menu FREQ frequency GAIN combined H GAIN horizontal gain V GAIN vertical gain ANGLE PRB DRV probe drive LP FILTER low pass filter ...

Page 94: ...resumption that the BondMaster 600 is set to RESON mode and the MAIN menu key has been pressed 5 3 5 PC RF Mode DISP DOTS Menu The DISP DOTS display dots menu allows you to change display options on the BondMaster 600 display The following parameters can be adjusted on the PC RF mode DISP DOTS menu RUN CURSOR GRID POSITION H POS V POS STORE NEXT RE WRITE DOT ERASE DOT ERASE ALL SET REF D ERASE PER...

Page 95: ...lay mode that the probe is currently operating in see Figure 5 8 on page 86 To change the RUN setting press the A key and then rotate the knob to the desired setting The RUN setting can also be accessed and changed by pressing the RUN direct function key on the left hand side of the BondMaster 600 front panel underneath the knob Changing the RUN will also change the availability of functions in th...

Page 96: ...rid Five screen grid types are available OFF 10 10 FINE COARSE and WEB By default the BondMaster 600 uses a 10 10 grid To adjust the grid setting press the D key With GRID highlighted rotate the knob to the desired grid value OFF The BondMaster 600 does not display a grid pattern 10 10 A 10 by 10 grid pattern is displayed with some unusable areas on the left and right sides of the screen FINE A gr...

Page 97: ...ay To adjust the null position press the C key With POSITION highlighted rotate the knob until the desired position is displayed H POS The H POS setting controls the null position of the flying dot in the horizontal axis when you are choosing a custom flying dot location To change the H POS setting press the D key and then rotate the knob to the desired horizontal position value V POS vertical pos...

Page 98: ...l button press has occurred The RE WRITE DOT function only allows you to rewrite the current dot location To rewrite a dot location press the B key ERASE DOT The ERASE DOT setting allows you to erase a dot location The ERASE DOT function allows you to erase the current dot location To erase a dot location press the C key Press the C key repeatedly to erase dots one at a time in the reverse order t...

Page 99: ... press the E key Alternatively the set reference parameter can be activated by pressing and holding the REF SAVE direct function key until an alert sound is heard D ERASE display erase The D ERASE display erase setting controls how often the BondMaster 600 display is automatically erased It is adjustable between zero off and 60 seconds in 0 1 second increments fine by default Alternatively you can...

Page 100: ...d after a predetermined amount of time This time may be set from 0 1 s to 10 s in 0 1 s increments By default PERSIST is set to OFF To activate the variable persistence setting press the B key With the variable persistence setting highlighted rotate the knob to adjust to the desired value SCAN TIME Allows you to set the duration of RUNs that use the SCAN view To change the SCAN TIME press the DISP...

Page 101: ...ed RECORD The RECORD setting enable you to display frequency tracking signal traces up to two traces during a RUN that uses the XY display To change the RECORD setting press the DISP DOTS menu key twice then press the E key and then rotate the knob to adjust the setting 5 3 7 MIA Mode DISP DOTS Menu The following parameters can be adjusted on the MIA Mode DISP DOTS display dots menu RUN POSITION H...

Page 102: ... that the BondMaster 600 is set to MIA mode and the DISP DOTS menu key has been pressed 5 3 8 RESON Mode DISP DOTS Menu In RESON resonance mode the following parameters can be adjusted on the DISP DOTS display and dots menu RUN POSITION H POS horizontal position V POS vertical position STORE NEXT RE WRITE DOT ERASE DOT ERASE ALL SET REF D ERASE display erase PERSIST CURSOR GRID SCAN TIME NOTE ...

Page 103: ... information is applicable when the BondMaster 600 is set to PC RF mode and the ALARM menu key has been pressed RF ALARM The RF ALARM setting controls the RF alarm type and can be set to OFF POS positive or NEG negative To change the RF ALARM setting press the A key and then rotate the knob to the desired alarm type TOP The TOP setting controls the alarm s upper threshold The displayed percentage ...

Page 104: ...94 To change the BOTTOM alarm threshold setting press the C key and then rotate the knob to the desired alarm threshold value DWELL The DWELL setting controls the amount of time that the alarm is active after the alarm condition has occurred The alarm duration is adjustable between 0 0 seconds off and 10 seconds An example of this control is shown in Figure 5 12 on page 95 To change the DWELL sett...

Page 105: ...e 5 12 Alarm DWELL control HORN The HORN setting controls the alarm horn The alarm horn has two options OFF or ON see Figure 5 13 on page 95 To change the HORN setting press the E key and then rotate the knob to the desired setting Figure 5 13 Alarm HORN control ...

Page 106: ...93 5 3 11 PC RF Mode ALARM Menu in XY SCAN and XY RUN The following parameters can be adjusted on the PC RF mode ALARM menu in XY SCAN and XY RUN SCAN ALM scan alarm see MIA Mode Alarm Menu on page 103 XY ALM 1 see PC Swept Mode ALARM Menu on page 96 XY ALM 2 see PC Swept Mode ALARM Menu on page 96 DWELL see PC RF Mode ALARM Menu in RF RUN on page 93 HORN see PC RF Mode ALARM Menu in RF RUN on pag...

Page 107: ...e A key and then rotate the knob to the desired setting XY ALM 1 XY alarm 1 The XY ALM 1 XY alarm 1 setting controls the XY 1 alarm type and can be set to OFF POS frequency positive or NEG frequency negative To change the XY alarm 1 type press the B key and then rotate the knob to the desired type XY ALM 2 XY alarm 2 The XY ALM 2 XY alarm 2 setting controls the XY 2 alarm type and can be set to OF...

Page 108: ... DWELL setting control Figure 5 15 The PC Swept mode s alarm HORN setting control SHAPE The SHAPE control is only available when the XY ALM 1 XY alarm1 or XY ALM 2 XY alarm 2 have been enabled Therefore the following information is applicable only if these alarms have been enabled NOTE ...

Page 109: ...ob to the desired alarm shape The chosen SHAPE can be adjusted using the function keys B C D and E Table 5 on page 99 shows the function key choices for the different alarm shapes 5 3 12 1 Changing BOX Alarm Parameters in PC Swept Mode The following information is applicable when the XY ALM 1 XY alarm 1 or XY ALM 2 XY alarm 2 menu is active and the BOX option is selected in the SHAPE menu see Figu...

Page 110: ... C key and then rotate the knob until the threshold is in the desired position LEFT controls the left side of the BOX alarm threshold To change the setting press the D key and then rotate the knob until the threshold is in the desired position RIGHT controls the right side of the BOX alarm threshold To change the setting press the E key and then rotate the knob until the threshold is in the desire...

Page 111: ...ange the setting press the C key and then rotate the knob until it is in the desired position STRT ANG starting angle controls the starting angle of the SECTOR alarm threshold To change the setting press the D key and then rotate the knob until it is in the desired position END ANG ending angle controls the ending angle of the SECTOR alarm threshold To change the setting press the E key and then r...

Page 112: ...sition of the CIRCLE alarm threshold To change the setting press the C key and then rotate the knob until the circle is in the desired position VERT vertical controls the vertical position of the CIRCLE alarm threshold To change the setting press the D key and then rotate the knob until the circle is in the desired position 5 3 12 4 Changing Spectrum Alarm Parameters in PC Swept Mode The following...

Page 113: ...desired position RIGHT controls the right side of the BOX alarm threshold To change the setting press the E key and then rotate the knob until the threshold is in the desired position 5 3 13 MIA Mode Alarm Menu The following parameters can be adjusted in the MIA mode ALARM menu DEFINE menu SCAN ALM scan alarm XY ALM 1 XY alarm 1 XY ALM 2 XY alarm 2 DWELL HORN XY ALM 1 XY alarm 1 menu SHAPE XY ALM ...

Page 114: ...e SCAN RUN displays To change the SCAN ALM setting press the A key and then rotate the knob to the desired setting The MIA mode s DWELL and HORN examples are shown in Figure 5 19 on page 104 and Figure 5 20 on page 104 Figure 5 19 The MIA mode s alarm DWELL setting controls Figure 5 20 The MIA mode s alarm HORN setting control ...

Page 115: ...arm 2 menu SHAPE For XY ALM and SHAPE parameter adjustment details see PC Swept Mode ALARM Menu on page 96 For SCAN ALM details see MIA Mode Alarm Menu on page 103 For DWELL and HORN details see PC RF Mode ALARM Menu in RF RUN on page 93 Parameter descriptions are based on the presumption that the BondMaster 600 is set to RESON resonance mode and the ALARM menu key has been pressed The RESON mode ...

Page 116: ...ESON mode s alarm HORN control 5 3 15 MEM Menu The MEM memory menu contains functions for storage of programs and screen display images Various editing functions are provided in this menu for previewing saved data recalling saved data editing file names adding notes setting a reference image and erasing saved data ...

Page 117: ...n another program location The following memory storage MEM functions are available PREVIEW You can use PREVIEW to view instrument screen images that were captured at the moment the data was saved To preview a stored data file press the MEM menu key rotate the knob until the desired data file is highlighted and then press the A key The instrument screen image that was stored when the data file was...

Page 118: ...e image press the MEM menu key rotate the knob until the desired data file is highlighted and then press the D key Alternatively a reference image may be created using the current screen image by pressing and holding the REF SAVE direct function key until the BondMaster 600 emits a sound alert To turn off a reference image press the MEM menu key and then press the E key An error message will appea...

Page 119: ...n when editing the file name or file text fields This section of the manual provides instructions on how to use this editor to change file names and file notes The following procedure is applicable when the MEM menu key has already been pressed and that the FILE MANAGER menu is displayed see Figure 5 23 on page 110 To use the memory text editor 1 Rotate the knob to highlight the file to be edited ...

Page 120: ...fault file name or file note will be deleted This is also the case for a previously edited FILE NAME or FILE NOTE However it is possible to avoid deletion retain the information by using the text editor navigations keys or buttons as outlined in the procedure steps that follow The navigation keys or special buttons in the text editor allow you to modify characters that have been mistakenly selecte...

Page 121: ...igation keys 1 Rotate the knob until the forward or backward arrow is highlighted 2 Press the FULL NEXT key until the cursor is in the correct location after the character to be deleted 3 Use the special deletion button to delete the character s by pressing the FULL NEXT key 4 If required use the knob and the FULL NEXT key to add new characters 5 After completing the deletion s or addition s press...

Page 122: ...M SETUP see Setting the User Interface Language and Decimal Symbol on page 63 APPL SELECT application select Provides access to the application selection menu which opens in a new window see Figure 5 24 on page 112 To select an application press the ADV SETUP menu key followed by the A key Rotate the knob to select the desired application and then press Or to exit the menu press the Return key Fig...

Page 123: ...reens menus to keep the text easy to read and to navigate see Figure 5 25 on page 113 Figure 5 25 The ALL SETTINGS menu first of two screens To select ALL SETTINGS press the ADV SETUP menu key followed by the B key To navigate the menu or to go to the next screen follow the instructions in the help text located at the bottom of the screen To select a setting to adjust press the FULL NEXT key until...

Page 124: ... BondMaster 600 includes user selectable color schemes The color palette on the screen can be changed as follows 1 Press the ADV SETUP menu key 2 Press the E key and then rotate the knob to select the color palette PASSWORD The stored data and the instrument reset capabilities can be protected with a password to prevent accidental deletion of data see Figure 5 26 on page 114 Figure 5 26 The PASSWO...

Page 125: ...lock options press the ADV SETUP menu key twice followed by the C key and then enter the option code for the upgrade For more information on this feature contact your local Olympus representative Contact information for your region can be found by visiting the Olympus website at http www olympus ims com en contact us ABOUT This feature displays the instrument s configuration and other important in...

Page 126: ...it press the Return key LEGAL INFO Displays legal or patent rights protection information for the BondMaster 600 To access the LEGAL INFO menu press the ADV SETUP menu key twice followed by the D key and then the B key To navigate the menu follow the instructions in the help text at the bottom of the screen To exit press the Return key REG Displays regulatory information for the BondMaster 600 see...

Page 127: ... the UPGRADE menu press the ADV SETUP menu key twice followed by the D key and the C key and then follow the instructions on the screen To exit press the Return key TESTS Provides user accessible tests to help troubleshoot the BondMaster 600 Tests include VIDEO TEST KEYPAD TEST SD CARD TEST and LED TEST To access the TESTS menu press the ADV SETUP menu key followed by the D key Rotate the knob unt...

Page 128: ...e Return key Subsequently the TESTS menu reappears on the BondMaster 600 display If an external SD card is not present during the SD card test FAILED is displayed for this storage device LED TEST Checks if the BondMaster 600 LEDs light emitting diodes are operational The LEDs are located at the top left corner of the BondMaster 600 and are marked with the numbers 1 2 and 3 During the test each of ...

Page 129: ... and Table 6 on page 119 2 To perform the reset press the A key 3 To exit press the Return key Figure 5 29 The RESET menu Table 6 Reset types Reset types Description Parameters reset Clears only the instrument settings and returns the BondMaster 600 to its default settings Storage reset Clears all stored programs and screen images Master reset Clears the BondMaster 600 settings stored programs and...

Page 130: ...DMTA 10045 01EN Rev E August 2016 Chapter 5 120 ...

Page 131: ...ollowing procedures can also be used as a good starting point for drafting your own procedures based on the BondMaster 600 Disclaimer This section is not to be used in place of authorized written procedures The procedures in this section are intended as guidelines for optimizing the BondMaster 600 features facilitating the configuration of commonly used bond testing applications and self training ...

Page 132: ...ection observed and should be respected The procedure in this section is intended as a general guideline on how to prepare a setup for a honeycomb composite part a similar procedure can easily be applied to a variety of skin and core materials Although PC RF or IMPULSE mode is a preferred technique for detecting skin to core disbonds in honeycomb composite a similar procedure can sometimes be used...

Page 133: ...r pitch catch and MIA modes 1 83 m 6 ft P N SBM CPM P11 U8800058 Pitch catch probe for general use tip spacing 14 mm P N S PC P14 U8800601 To set the initial BondMaster 600 configuration 1 Connect the probe and the cable to the PROBE connector of the BondMaster 600 2 When prompted press CONTINUE A key to accept the PowerLink probe information If you are using a non PowerLink probe access the APPL ...

Page 134: ...MAIN menu key once and set the FREQ A key to 11 kHz using the knob 2 Set the probe tips over a good area of the standard adjust the gain using the GAIN key and then ensure that the signal in the RF view left is contained between 1 to 2 vertical divisions see Figure 6 3 on page 124 Figure 6 3 The GAIN adjustment to obtain a contained signal ...

Page 135: ...4 Detecting the far side and near side disbonds GATE setup By default the GATE is set to AUTO In AUTO mode the BondMaster 600 automatically detects the peak signal from the RF view and uses it to construct the XY flying dot view 5 If desired manually set the gate to the desired position by pressing GATE D key and rotating the knob A recommended GATE position would be the peak of the first reflecti...

Page 136: ...mode applies an envelope filter over the RF signal The name IMPULSE originates from earlier BondMaster products 6 If preferred set the RF DISPLAY E key to IMPULSE see Figure 6 6 on page 127 However it is recommended to use the RF DISPLAY mode because it allows easier interpretation of each signal oscillation NOTE ...

Page 137: ...ns To optimize the identification of near side and far side disbonds 1 Press the RUN key once to display the XY flying dot single view 2 Set the probe s tips over a good area of the standard and then press the CAL NULL key 3 Scan over the far side and near side disbonds and then while you keep the probe moving over the disbonds press the FREEZE key see Figure 6 7 on page 128 TIP ...

Page 138: ...y and then adjust the signal angle so the far side disbond goes down and the near side disbond goes up see Figure 6 8 on page 128 Figure 6 8 Adjusting the disbond signal angle 5 If necessary adjust the H GAIN C key and V GAIN D key to obtain a clearer distinction between the near and far side disbonds see Figure 6 9 on page 129 ...

Page 139: ...e acquisition 7 Press the FULL NEXT key to toggle to full screen mode The readings display in real time the amplitude A and phase of the XY flying dot see Figure 6 10 on page 129 For information on how to change the real time readings see Displaying Real Time Readings on page 58 Figure 6 10 The amplitude A and phase of the XY flying dot ...

Page 140: ...y switch between various signal representations during inspection in full or normal screen mode press the RUN key repeatedly to obtain the desired RUN The available RUNs are shown in Figure 6 11 on page 130 through Figure 6 15 on page 132 Figure 6 11 RUN 1 RF signal Figure 6 12 RUN 2 RF XY default view ...

Page 141: ...DMTA 10045 01EN Rev E August 2016 Applications 131 Figure 6 13 RUN 3 XY FLY DOT Figure 6 14 RUN 4 XY SCAN ...

Page 142: ...arm box parameters horn or external horn louder For more details about alarms see Alarms Connectivity and Memory Specifications on page 217 2 Depending on your requirements change your real time readings The default real time readings display the XY signal s live amplitude and phase For information on how to change the real time readings see Displaying Real Time Readings on page 58 The list of all...

Page 143: ...specially well with aluminum honeycomb cores The PC Swept technique typically works better for near side disbonds than far side disbonds It can also be used to inspect flatter or constant geometry parts although the RF and IMPULSE techniques are typically preferred for such parts particularly for thicker assemblies This procedure describes how to set up for a typical PC Swept inspection using an a...

Page 144: ...catch and MIA modes 1 83 m 6 ft P N SBM CPM P11 U8800058 Pitch catch probe for general use tip spacing 14 mm P N S PC P14 U8800601 To set the initial BondMaster 600 configuration 1 Connect the probe and the cable to the PROBE connector of the BondMaster 600 2 When prompted press CONTINUE A key to accept the PowerLink probe information If you are using a non PowerLink probe access the APPL SELECT m...

Page 145: ... and then use the knob to set the START FREQ C key to 10 kHz and the STOP FREQ D key to 40 kHz 2 Place the probe tips on a good part of the standard press the GAIN key and then use the knob to adjust the gain until the swept figure is contained between two divisions inside the alarm box see Figure 6 19 on page 135 Figure 6 19 The swept figure between two divisions ...

Page 146: ... full screen display of the scan To fine tune the instrument settings 1 Depending on your requirements set the alarm box parameters horn or external horn louder For more details about alarms see Alarms Connectivity and Memory Specifications on page 217 2 Depending on your requirements change your real time readings The default real time readings display the XY signal s live peak to peak amplitude ...

Page 147: ... are ideal for detecting smaller defects in honeycomb composites This procedure demonstrates how to use the MIA test mode to detect defects in honeycomb composite assemblies using a suggested test frequency A more advanced procedure for determining the best test frequency for your particular situation is explained in Finding the Best Frequency to Inspect Honeycomb Composite Mechanical Impedance An...

Page 148: ...ble for pitch catch and MIA modes 1 83 m 6 ft P N SBM CPM P11 U8800058 Right angle MIA probe 13 mm 0 5 in tip P N S MP 3 U8010011 To set the initial BondMaster 600 configuration 1 Connect the probe and the cable to the PROBE connector of the BondMaster 600 2 When prompted press CONTINUE A key to accept the PowerLink probe information If you are using a non PowerLink probe access the APPL SELECT me...

Page 149: ...e signals 1 Press the MAIN menu key once and then set the FREQ A key to 10 kHz using the knob 2 Place the probe tip on a good part of the standard CFRP side and then press the CAL NULL key 3 Slowly scan over one of the 13 mm 0 5 in disbonds and then press the FREEZE key see Figure 6 24 on page 139 Figure 6 24 The scan signal of a disbond ...

Page 150: ...rm box see Figure 6 25 on page 140 Figure 6 25 The signal angle adjusted upwards 5 Press the GAIN key and then adjust the signal amplitude so that the disbond signal enters the alarm box and extends approximately 5 divisions from the null position cross hairs see Figure 6 26 on page 140 Figure 6 26 The signal amplitude adjusted to enter the alarm box ...

Page 151: ...ent settings 1 Depending on your requirements set the alarm box parameters horn or external horn louder For more details about alarms see Alarms Connectivity and Memory Specifications on page 217 2 Depending on your requirements change your real time readings The default real time readings display the XY signal s live amplitude and phase For information on how to change the real time readings see ...

Page 152: ...s the mechanical impedance or stiffness of materials it displays a high contrast between a repaired potted area which is stiff and a disbond which has low mechanical resistance This contrast characteristic allows you to use the MIA test technique to identify repaired areas in honeycomb composite Inspection materials are shown in Figure 6 29 on page 142 Figure 6 29 Materials repaired areas potting ...

Page 153: ...800058 Right angle MIA probe 13 mm 0 5 in tip P N S MP 3 U8010011 To set the initial BondMaster 600 configuration 1 Connect the probe and the cable to the PROBE connector of the BondMaster 600 2 When prompted press CONTINUE A key to accept the PowerLink probe information If you are using a non PowerLink probe access the APPL SELECT menu A key using the ADV SETUP menu key 3 Select the Smaller Disbo...

Page 154: ... press the CAL NULL key 4 Lift the probe into the air to observe the dot s movement if the dot disappears off the screen press the GAIN key and then use the knob to adjust the dot position so that it remains on the screen see Figure 6 31 on page 144 Figure 6 31 Adjusting the dot position 5 Place the probe tip on a good part of the standard and then press the CAL NULL key 6 Slowly scan over a disbo...

Page 155: ... ANGLE E key and adjust the signal angle so that the disbond signal points upwards at 90 see Figure 6 33 on page 145 Figure 6 33 Adjusting the signal angle upwards 8 Press the GAIN key and then adjust the signal amplitude so that the disbond signal extends to about 4 divisions away from the null position crosshairs see Figure 6 34 on page 146 ...

Page 156: ...e signal amplitude 9 Press the FREEZE key to unfreeze the acquisition press the FULL NEXT key to display the full screen and then slowly scan over the disbond and repaired area again see Figure 6 35 on page 146 Figure 6 35 The second scan over the disbond and repaired area ...

Page 157: ...e 58 The list of all parameters is shown in Figure 6 36 on page 147 Figure 6 36 The list of all parameters 6 1 5 Inspecting Metal to Metal Bonds Resonance Technique The resonance mode is the preferred test mode for inspecting metal to metal bonds The smaller footprint of the resonance probes enables easy access around fasteners The resonance technique requires a low viscosity couplant to work prop...

Page 158: ...sonance low viscosity couplant bottle 118 ml 4 oz P N 3308193 U8770328 Resonance probe cable 3 35 m 11 ft P N SBM CR P6 U8800059 250 kHz resonance probe P N S PR 5 U8010010 To set the initial BondMaster 600 configuration 1 Connect the probe and the cable to the PROBE connector of the BondMaster 600 2 When prompted press CONTINUE A key to accept the PowerLink probe information If you are using a no...

Page 159: ...To Metal Disbonds application 4 If the calibration menu does not appear automatically press and hold the CAL NULL key 5 Hold the probe in the air The BondMaster 600 should automatically pick the best operating frequency for the probe When in doubt press CAL C key or change the FREQ D key using the knob 6 Press DONE E key see Figure 6 39 on page 149 Figure 6 39 The CAL screen ...

Page 160: ...e on a good area of the standard and then press the CAL NULL key 4 Slowly glide the probe over the first disbond and hold it there 5 Press the DISP DOTS menu key twice to display the DOTS screen 6 Press STORE NEXT A key to record the first dot see Figure 6 40 on page 150 Figure 6 40 The first dot recorded 7 Slowly glide the probe over the second disbond and then press STORE NEXT A key to record th...

Page 161: ...the ERASE key 9 Press the MAIN menu key once to display the MAIN menu screen 10 Adjust the ANGLE E key as necessary so that the dots move up in the XY view 11 Adjust the GAIN B key to set the higher dot at approximately 90 of the screen height see Figure 6 42 on page 151 Figure 6 42 The GAIN adjusted to set the higher dot ...

Page 162: ... over the disbonds To fine tune the instrument settings 1 Depending on your requirements set the alarm box parameters horn or external horn louder For more details about alarms see Alarms Connectivity and Memory Specifications on page 217 2 Depending on your requirements change your real time readings The default real time readings display the XY signal s live amplitude and phase For information o...

Page 163: ... resonance technique is the recommended method of detecting delamination between composite material layers The location of the interply delamination or the thickness of the part can often be estimated from the signal phase in the XY view This procedure shows you how to calibrate the resonance mode for use as a typical go no go test Inspection materials are shown in Figure 6 45 on page 154 ...

Page 164: ...nance low viscosity couplant bottle 118 ml 4 oz P N 3308193 U8770328 Resonance probe cable 3 35 m 11 ft P N SBM CR P6 U8800059 250 kHz resonance probe P N S PR 5 U8010010 To set the initial BondMaster 600 configuration 1 Connect the probe and the cable to the PROBE connector of the BondMaster 600 2 When prompted press CONTINUE A key to accept the PowerLink probe information If you are using a non ...

Page 165: ...nation and Laminates Inspection application 4 If the calibration menu does not appear automatically press and hold the CAL NULL key 5 Hold the probe in the air The BondMaster 600 should automatically pick the best operating frequency for the probe When in doubt press CAL C key or change the FREQ D key using the knob 6 Press DONE E key see Figure 6 47 on page 155 Figure 6 47 The CAL screen ...

Page 166: ...e on a good area of the standard and then press the CAL NULL key 4 Slowly glide the probe over the first disbond and hold it there 5 Press the DISP DOTS menu key twice to display the DOTS screen 6 Press STORE NEXT A key to record the first dot see Figure 6 48 on page 156 Figure 6 48 The first dot recorded 7 Slowly glide the probe over the second disbond and then press STORE NEXT A key to record th...

Page 167: ...hird disbond and then press STORE NEXT A key to record the third dot see Figure 6 50 on page 157 Figure 6 50 The third dot recorded 9 Release the probe and then press the ERASE key 10 Press the MAIN menu key once to display the MAIN menu screen 11 Adjust the ANGLE E key as necessary so that the dots move up in the XY view ...

Page 168: ...igure 6 51 The GAIN adjusted to set the highest dot 13 Press the ALARM menu key twice to display the XY ALM 1 screen and then set the BOTTOM C key to 30 14 Press the FULL NEXT key to display the full screen and then slowly scan over the disbonds and ensure that the dots still match the signal see Figure 6 52 on page 158 Figure 6 52 The second scan over the disbonds ...

Page 169: ...s live amplitude and phase For information on how to change the real time readings see Displaying Real Time Readings on page 58 To activate an alternate display Press the RUN key as necessary to display the amplitude and phase components against time This representation is particularly useful when inspecting materials with variations in thickness because both the phase and amplitude components cha...

Page 170: ... Frequency Using PC Swept Technique The pitch catch PC Swept mode of the BondMaster 600 features a new SPECTRUM representation This representation is useful for understanding the frequency response of a given test specimen and helps you choose the best operating frequency The instructions in this section are intended as guidelines for maximizing your frequency analysis results These guidelines are...

Page 171: ... 25 mm 1 in delaminations and two 25 mm 1 in repairs P N CHRS 1 3 U8860626 Cable for pitch catch and MIA modes 1 83 m 6 ft P N SBM CPM P11 U8800058 Pitch catch probe for general use tip spacing 14 mm P N S PC P14 U8800601 To set the initial BondMaster 600 configuration 1 Connect the probe and the cable to the PROBE connector of the BondMaster 600 2 When prompted press CONTINUE A key to accept the ...

Page 172: ... menu key once and set the SW RATE E key to LOW When developing an application or procedure the lower sweep rate setting usually provides the best results 5 If necessary adjust the START FREQ C key and STOP FREQ D key values As a general starting point values in the range of 5 kHz to 50 kHz are usually very suitable 6 Press the RUN key once to display the SPEC XY RUN 7 Press the MAIN menu key agai...

Page 173: ... misleading when doing the frequency analysis To distinguish the useful frequencies from unsuitable frequencies first probe pass 1 Place the probe tips on a good part of the standard then press the GAIN key and adjust the GAIN until the swept figure is contained between two divisions inside the alarm box see Figure 6 57 on page 163 Figure 6 57 The swept figure between two divisions 2 Lift probe in...

Page 174: ... amplitude difference rather than highest peak Often the best operating frequency is not the one that provides the highest peak but the one that provides the highest contrast between a good bond and a defective bond b Try to identify the minimum and maximum useful frequencies often only a smaller portion of the spectrum usually the lower end is truly useful Using the frequency markers try to locat...

Page 175: ...steps 1 6 but this time focus on the various defects a Scan slowly using a circular motion b Take notes for every defect material frequency evaluated etc c Try to find common frequencies that enable you to detect the various defects under various conditions A universal frequency is always better because it will simplify the test d The ultimate goal of finding the best test frequencies is to enable...

Page 176: ... 60 The frequency tracking signal trace 6 2 2 Finding the Best Frequency to Inspect Honeycomb Composite Mechanical Impedance Analysis MIA Technique The expanded frequency range of the BondMaster PC enables you to use the MIA method at frequencies up to 50 kHz This procedure explains how to identify the best operating frequencies for writing a MIA procedure Inspection materials are shown in Figure ...

Page 177: ...isbonds two 25 mm 1 in delaminations and two 25 mm 1 in repairs P N CHRS 1 3 U8860626 Cable for pitch catch and MIA modes 1 83 m 6 ft P N SBM CPM P11 U8800058 Right angle MIA probe 13 mm 0 5 in tip P N S MP 3 U8010011 To set the initial BondMaster 600 configuration 1 Connect the probe and the cable to the PROBE connector of the BondMaster 600 2 When prompted press CONTINUE A key to accept the Powe...

Page 178: ...ler Disbonds and Repair Identification application To select the frequency 1 Make sure that you can locate all defects on the reference standard 2 Press and hold the CAL NULL key to open the CAL calibration screen 3 Adjust the frequency limits as necessary using the knob 4 Hold the probe tip over the smaller or most critical defect and then press BAD PART E key see Figure 6 63 on page 169 ...

Page 179: ... on page 169 Figure 6 64 The signal for the defect free zone 6 If necessary select the best operating frequency for your needs by adjusting the FREQ D key using the knob see Figure 6 65 on page 170 In many situations the BondMaster 600 automatically picks the best operating frequency However for some more complex or noisier applications it is recommended to manually select the frequency ...

Page 180: ... probe If your results were unsatisfactory this might have been because you did not hold the probe properly d The use of a probe holder is NOT recommended because it can impact the mechanical impedance of the area being scanned Figure 6 65 Selecting the best operating frequency 7 When you have obtained a satisfactory frequency press DONE E key To calibrate the signals 1 With the frequency properly...

Page 181: ...he XY view see Figure 6 66 on page 171 Figure 6 66 Adjusting the angle to move the dot upwards 3 If necessary press the GAIN key and adjust the GAIN to keep the air signal dot on the screen see Figure 6 67 on page 172 The MIA probes exhibit a very high sensitivity from 10 kHz to 18 kHz and therefore you should expect to use much lower gains for example around 25 dB NOTE ...

Page 182: ...ignal dot 4 Place the probe tip on a defect free section press the CAL NULL key again and then slowly scan over the defect s make sure that the detection is satisfactory and if necessary adjust the GAIN H GAIN or V GAIN see Figure 6 68 on page 172 Figure 6 68 The second scan over the defect s ...

Page 183: ... This program allows a PC computer to communicate with the BondMaster 600 7 1 USB Communication The default communication protocol for the BondMaster 600 is USB 2 0 7 2 Screen Capture Using BondMaster PC The BondMaster PC software allows you to capture screen images while operating the BondMaster 600 For details about screen captures performed without BondMaster PC see Hidden Function Screen Captu...

Page 184: ...igure 7 1 BondMaster PC Device menu 4 In the Capture Screen dialog box click Start Capture see Figure 7 2 on page 174 Figure 7 2 The Capture Screen dialog box 5 When the BondMaster PC has obtained the current instrument screen image proceed as follows ...

Page 185: ...ster 600 instrument software via a USB connection The instrument software to upgrade must first be downloaded via the internet or other means and then saved to a file location on the PC To upgrade the BondMaster 600 instrument software 1 Press the ADV SETUP menu key twice 2 Press the D key to select the ABOUT menu see Figure 7 3 on page 175 Figure 7 3 The ABOUT menu 3 Press the C key to select the...

Page 186: ...DE menu 4 Connect the battery charger to the BondMaster 600 A message is displayed that indicates whether or not the battery charger is connected see Figure 7 5 on page 176 and Figure 7 6 on page 177 Figure 7 5 The message indicating the battery charger is not connected ...

Page 187: ... is connected The software upgrade will not proceed until the BondMaster 600 battery charger is connected to the BondMaster 600 instrument 5 On the BondMaster PC Utilities menu select Upgrade see Figure 7 7 on page 177 The Upgrade Device dialog box opens see Figure 7 8 on page 178 Figure 7 7 The Utilities menu NOTE ...

Page 188: ...eate an individual PDF file from selected data or export all data as a series of PDF files If you select the Export All Files As Adobe Acrobat PDF option all stored data on the BondMaster 600 instrument will automatically be selected and used to create individual PDF files that will be saved in a specified location At the end of this process the individual PDF files may be reviewed and printed usi...

Page 189: ...the BondMaster PC window Figure 7 10 The File menu To export all data using the Export All Files As Adobe Acrobat PDF option On the BondMaster PC File menu select Export All Files As Adobe Acrobat PDF see Figure 7 10 on page 179 Selection for exporting a single file Selection for exporting all files ...

Page 190: ...lect Remote Command see Figure 7 11 on page 180 The command list opens in a separate window using the PC s default software for viewing PDF files Figure 7 11 Selecting the Remote Command To issue remote commands 1 On the Device menu select Issue Command see Figure 7 12 on page 180 The Issue Command dialog box opens Figure 7 13 on page 181 Figure 7 12 The Device menu Issue Command ...

Page 191: ... X Table 7 on page 182 lists the commands and the format in which they must be written 3 In the Issue Command dialog box click Send see Figure 7 13 on page 181 OR Press Enter on your PC keyboard The BondMaster 600 remote command convention is as follows Read R commands end with Example ANG Write W commands include followed by a value with no spaces Example ANG 45 Execute X commands include only th...

Page 192: ... R W 0 000 10 000 ANG Angle 1 R W 0 000 359 900 ANI Angle Step Increment R 0 100 N A ASE Sweep Erase R W ON OFF AST Auto Sweep Time R W 0 005 10 000 AUE Auto Erase After Null R W ON OFF ALC Alarm Condition R ON OFF ALMXY1 Alarm Type 1 R W OFF FRQ_NEG FRQ_POS ALMXY1SHAPE Alarm Shape 1 R W BOX SECTOR CIRCLE ALMXY1BTOP Alarm 1 Box Top R W 0 0 100 0 ALMXY1BBOT Alarm 1 Box Bottom R W 0 0 100 0 ALMXY1BL...

Page 193: ...cal R W 0 0 99 5 ALMXY2 Alarm Type 2 R W OFF FRQ_NEG FRQ_POS ALMXY2SHAPE Alarm Shape 2 R W BOX SECTOR CIRCLE ALMXY2BTOP Alarm 2 Box Top R W 0 0 100 0 ALMXY2BBOT Alarm 2 Box Bottom R W 0 0 100 0 ALMXY2BLEFT Alarm 2 Box Left R W 0 0 100 0 ALMXY2BRIGHT Alarm 2 Box Right R W 0 0 100 0 ALMXY2SIDIA Alarm 2 Sector Inner Diameter R W 7 0 263 0 ALMXY2SODIA Alarm 2 Sector Outer Diameter R W 7 0 263 0 ALMXY2...

Page 194: ... R W N A N A ALMSCNTOP Alarm Scan Top R W N A N A ALMSCNBOT Alarm Scan Bottom R W N A N A ALMSPC Alarm Type Spectrum R W OFF FRQ_NEG FRQ_POS ALMSPCCHN Alarm Spectrum Channel R W AMPLITUDE PHASE ALMSPCTOP Alarm Spectrum Top R W 0 0 100 0 ALMSPCBOT Alarm Spectrum Bottom R W 0 0 100 0 ALMSPCLEFT Alarm Spectrum Left R W 0 0 100 0 ALMSPCRIGHT Alarm Spectrum Right R W 0 0 100 0 ALMR Alarm Type RF R W OF...

Page 195: ...M Cal Display Mode R W ABS_AMPL ABS_PHAS DIF_AMPL or DIF_PHAS CLB Color Brightness R W 0 25 50 75 100 CSH Color Scheme R W DEFAULT OUTDOORS RED GREEN BLUE PINK CLASS OFFICE CNL Set Continuous Null R W OFF 0 2 Hz 0 5 Hz 1 0 Hz CTE Display Erase Time R W 0 0 60 0 CYC Cycles R W 1 10 DAL Data Location R W 1 Entries in Datalogger DAN Data Name R W Valid name in Datalogger DAS Up Download Data Only R N...

Page 196: ...N A DSC Powerlink Probe Description R Probe Description String DLRC Number Backup Files on External SD Card R 0 502 ERS Screen Erase X N A N A EXH External Horn R W ON OFF FILEREADXML 2 Read File in XML Format From Gage R N A N A FILEWRITEXML 2 Write XML File to Gage W N A N A F1T Frequency 1 Tracking R W OFF or a value between the start and stop frequencies Table 7 BondMaster 600 remote commands ...

Page 197: ... A N A FSP Stop Frequency R W PC RF 1 0 50 0 SWEPT 5 0 100 0 MIA 1 0 10 0 RESON 1 0 500 0 FST Start Frequency R W PC RF 1 0 50 0 SWEPT 5 0 100 0 MIA 1 0 10 0 RESON 1 0 500 0 GMD Gage Mode R W PC_ RF PC_SWEPT MIA RESON GN1 Frequency Gain 1 R W 0 0 100 0 GRT Grid Type R W OFF 10 10 FINE COARSE WEB GTP Gate Position R W AUTO or 0 7920 0 Table 7 BondMaster 600 remote commands continued Command Descrip...

Page 198: ...RN Alarm Horn Volume R W ON OFF HWV Hardware Version R DxDDDD where D is 0 9 A F HW Hardware Version R DxDDDD where D is 0 9 A F ISN Instrument Serial Number R N A N A KEY Key Command W MAIN DISPLAY ALARM MEMORY SETUP NUL ERASE SAVE FREEZE AUTO LIFT REF GAIN RUN ENTER ESCAPE NEXT FULL_NEXT A B C D E KNOB Knob Command W CCW CW UP DOWN KER Erase Display X N A N A Table 7 BondMaster 600 remote comman...

Page 199: ...tes R W 0 59 MON Month R W 1 12 MPC Powerlink Probe Class R String describing class MPD Powerlink Probe Mode R String describing mode MPS Powerlink Probe S N R String of Serial Number NAM Instrument Name R B600 B600M OPTIONSKEY Set Option Key W String with Valid Code PCM Radix Point R W PERIOD COMMA PDR Probe Drive R W LOW MEDIUM HIGH PEF Program Status R N A N A PGL Program Location R Selected fi...

Page 200: ...Number PRINTSCREEN Screenshot R N A N A REC Record R W 0 1 60 0 RDI Instrument Battery Current R N A N A RDV Instrument Battery Voltage R N A N A RLK Lock R ON OFF RT1 Reading 1 Type R W OFF AMP_VMAX VP P HP P Phase Amp_p p RT2 Reading 2 Type R W OFF AMP_VMAX VP P HP P Phase Amp_p p Table 7 BondMaster 600 remote commands continued Command Description R W X Range valid strings Min Max ...

Page 201: ...RUNTIME Total Run Time R N A N A SCT Scan Time R W N A N A SEC Seconds R W 0 59 SNO Gage Serial Number R XXXX XXXX XXXX XXXX where X is 0 9 A F SRT Swept Rate R W LOW MEDIUM HIGH SW Software Version R N A N A TIM Clock Time R XX XX TGT Gate Position R W 0 59 TMD Trace Mode R W DOT BOX TMW Time Window R W ON OFF Table 7 BondMaster 600 remote commands continued Command Description R W X Range valid ...

Page 202: ...ers No spaces Use character for space UI5 User Info 5 R W Max 40 Characters No spaces Use character for space UI6 User Info 6 R W Max 40 Characters No spaces Use character for space UI7 User Info 7 R W Max 40 Characters No spaces Use character for space UI8 User Info 8 R W Max 40 Characters No spaces Use character for space UI9 User Info 9 R W Max 40 Characters No spaces Use character for space Ta...

Page 203: ...0 Characters No spaces Use character for space UI14 User Info 14 R W Max 40 Characters No spaces Use character for space UI15 User Info 15 R W Max 40 Characters No spaces Use character for space VAP Variable Persistence R W 0 0 10 0 VER Software Version R N A N A VGN Freq 1 Vert Gain R W 0 0 60 0 VPO Vertical Position R W 0 100 VER_PIC PIC Version R N A N A WD1 Width 1 R W 360 10000 YR Year R W 20...

Page 204: ...licking Remote Control in the Device menu see Figure 7 12 on page 180 The software s Remote Command dialog box will then display an image of the front face of the BondMaster 600 including its control buttons and display You can then control the instrument in the same way as you would if it were in front of you see Figure 7 14 on page 195 To display the instrument screen you must first click Refres...

Page 205: ...mote Command dialog box Knob Function in Remote Control Operation In remote control mode the knob is separated into two regions Clicking the top half of the knob increases setting values and clicking the bottom half of the knob decreases setting values see Figure 7 15 on page 196 ...

Page 206: ...er PC software s File Manager lets you rename delete and recall files that are stored on the BondMaster 600 To access the File Manager On the BondMaster PC software Device menu select File Manager see Figure 7 16 on page 197 The Manage File dialog box appears see Figure 7 17 on page 197 Increase Decrease ...

Page 207: ...wing functions are available Delete delete files on the BondMaster 600 instrument Rename rename files on the BondMaster 600 instrument which is especially useful when naming files related to a specific inspection or customer Recall recall a file on the BondMaster 600 instrument Refresh File List refresh the file list in the BondMaster PC software ...

Page 208: ...see Figure 7 18 on page 198 2 Click Yes to confirm file deletion OR Click No to cancel the file deletion If you click Yes to confirm file deletion in the Confirmation dialog box the file is permanently deleted and it cannot be retrieved Figure 7 18 The Confirmation dialog box for file deletion To rename a file on the BondMaster 600 1 In the Manage File dialog box choose the file to be renamed and ...

Page 209: ...e on the BondMaster 600 1 In the Manage File dialog box choose the file to be recalled and then click Recall see Figure 7 17 on page 197 The Confirmation dialog box appears asking you to confirm that you want to recall the selected file see Figure 7 20 on page 199 Figure 7 20 Message asking you to confirm the recall 2 Click Yes to confirm the file recall OR Click No to cancel the file recall If yo...

Page 210: ...ment models have identical hardware capable of full functionality You can easily upgrade your instrument model s functionality using the BondMaster PC software s Unlock Options it is not necessary to send the instrument to the factory for upgrade To unlock options 1 On the BondMaster PC software Device menu select Unlock Options see Figure 7 21 on page 200 The Unlock Options dialog box opens see F...

Page 211: ...ster 600 instrument features are unlocked and ready for use 7 9 Backup The BondMaster PC software allows you to easily back up and clone your BondMaster 600 files The backup file is stored externally on the microSD memory card of the BondMaster 600 being backed up To back up a BondMaster 600 1 Make sure that a microSD card is inserted in the BondMaster 600 see Figure 7 23 on page 202 ...

Page 212: ...croSD card location 2 On the BondMaster PC software Utilities menu select Backup see Figure 7 24 on page 202 The Backup dialog box appears see Figure 7 25 on page 203 Figure 7 24 The Backup command 3 In the Backup dialog box click Start microSD card slot microSD card ...

Page 213: ... Figure 7 27 The Backup dialog box complete 7 10 Restore The BondMaster PC software allows you to easily restore and clone your BondMaster 600 files using a previously created backup file on the external microSD memory card of the instrument This backup file is stored separately from the internal storage of the instrument so that it can overwrite replace the internally stored information if necess...

Page 214: ...ilities menu select Restore see Figure 7 28 on page 204 The Restore dialog box appears see Figure 7 29 on page 204 Figure 7 28 The Restore command 3 In the Restore dialog box click Start Figure 7 29 The Restore dialog box start 4 When the Confirmation dialog box appears see Figure 7 30 on page 204 click OK to start the restore process Figure 7 30 The Confirmation dialog box to confirm the restore ...

Page 215: ...05 Restoring erases all contents of the internal memory and replaces it with the data contained on the external microSD card 5 When the restore process has been completed click Close see Figure 7 31 on page 205 Figure 7 31 The Restore dialog box complete NOTE ...

Page 216: ...DMTA 10045 01EN Rev E August 2016 Chapter 7 206 ...

Page 217: ...pletes the percentage of remaining battery life is displayed on the battery indicator When the battery charge becomes insufficient the BondMaster 600 automatically turns off to prevent damage to the battery Recharge the battery using the charger and power cord supplied with the instrument Charging the Battery The charger adaptor indicator light battery charge LED illuminates red while the battery ...

Page 218: ...e and durable as long as they are carefully handled Do not drop the probes on hard surfaces Do not hit the probes with any objects Resonance probes should always be used with Teflon tape on the inspection surface In addition to prolonging the life of the probe this measure also makes the probe easier to use Pitch catch probes should have their active and stabilizing probe tips inspected and replac...

Page 219: ... Specifications Table 8 on page 209 provides the general and environmental specifications Table 8 General and environmental specifications Category Parameter Value Housing Overall dimensions width height depth 236 mm 167 mm 70 mm 9 3 in 6 57 in 2 76 in Weight 1 70 kg 3 75 lb including lithium ion battery Other Factory installed hand strap and back instruction label ...

Page 220: ...by Class I Division 2 Group D as found in the National Fire Protection Association Code NFPA 70 Article 500 and tested using MIL STD 810F Method 511 5 Procedure I Batteries Battery model 600 BAT L 2 Li ion U8760058 Battery type Single lithium ion rechargeable battery or AA size alkaline batteries in 8 cell holder Battery storage temperature 0 C to 50 C 32 F to 122 F at 80 relative humidity Battery...

Page 221: ...lable display modes depend on the BondMaster 600 model and selected operating mode Choice of RF view time based waveform featuring raw waveform named RF or signal amplitude envelope named IMPULSE single impedance plane also named XY flying dot split screen RF and XY strip chart named SCAN representing amplitude and phase against time split screen XY SCAN SPECTRUM amplitude and phase against freque...

Page 222: ...nsion Table 10 BondMaster 600 Input Output 15 pin I O connector Pin Signal Description 1 AOUT_1 Analog Output 1 2 AOUT_2 Analog Output 2 3 AOUT_3 Analog Output 3 4 AOUT_4 Analog Output 4 5 AOUT_5 Analog Output 5 6 AOUT_6 Analog Output 6 7 GND Ground 8 VDD 5 V voltage 9 ENCD_INT Encoder Interrupt future expansion 10 ENCD_DIR Encoder Direction future expansion 11 GND Ground 12 HW_IO_1 Hardware I O 1...

Page 223: ...Ground 7 GND Ground 8 GND Ground 9 NC Not connected 10 GND Ground 11 NC Not connected 12 NC Not connected 13 LCD_HSYNC Horizontal sync 14 LCD_VSYNC Vertical sync 15 NC Not connected a Standard VGA output configuration Table 12 Bond testing specifications Category Parameter Value Bond testing connections Probe connectors 11 pin Fischer Number of probe inputs 1 Table 11 BondMaster 600 VGA 15 pin por...

Page 224: ...es as well as other main probe and accessory suppliers Gain 0 dB to 100 dB in 0 1 dB or 1 dB increments Certain test modes have limitations within this range Rotation 0 to 359 9 in 0 1 or 1 increments Scan Variable from 0 520 s to 40 s Certain screen configurations have limitations within this range Low pass filter 6 Hz to 300 Hz Certain test modes have limitations within this range Probe drive LO...

Page 225: ...ting amplitude and phase against time split screen XY SCAN Frequency range 1 kHz to 50 kHz Gain RF waveform gain raw signal 0 dB to 70 dB adjustable in 0 1 dB or 1 dB increments An additional 0 dB to 60 dB is available for the XY flying dot display Width 360 μs to 10 ms adjustable in 50 μs increments Gate 10 μs to 7920 μs adjustable in 10 μs steps New AUTO gate mode that auto detects the peak ampl...

Page 226: ...edance plane also named XY flying dot SPECTRUM amplitude and phase against frequency and split screen XY SPECTRUM Frequency range 5 kHz to 100 kHz Gain 0 dB to 60 dB adjustable in 0 1 dB increments Sweep rate LOW MEDIUM and HIGH user adjustable rate controlling the repeat rate Frequency tracking Up to 2 user adjustable markers to monitor 2 specific frequencies from the swept figure Table 13 Pitch ...

Page 227: ...on menu to determine best frequency for application based on simple BAD PART and GOOD PART measurements Frequency range 2 kHz to 50 kHz Gain 0 dB to 100 dB adjustable in 0 1 dB increments Low pass filter 6 Hz to 500 Hz Dot recordings Up to 25 user defined dot recordings Resonance Display modes RUN key Choice of single impedance plane also named XY flying dot strip chart named SCAN representing amp...

Page 228: ... time based and SPEC spectrum featuring selection of AMPLITUDE or PHASE Connectivity and memory PC software BondMaster PC software included in base BondMaster 600 kit BondMaster PC enables viewing saved files and printing reports On board preview Yes selectable with knob Data storage 500 files Reference signal Instant or recalled from memory Table 16 Interface specifications Category Parameter Val...

Page 229: ... with All Settings screens for easy configuration within a procedure Applications Application selection menu for easy and rapid configuration Real time readings Available readings depend on the BondMaster 600 model and selected operating mode Choice of up to 2 real time readings measuring signal characteristics selection of 4 amplitude measurements and 1 angle measurement Table 16 Interface specif...

Page 230: ...DMTA 10045 01EN Rev E August 2016 Appendix A 220 ...

Page 231: ...number Chest harness 4 point connection EP4 CH U8140055 600 Series instrument stand assembly replacement part 600 STAND U8780296 External alarm booster adaptor N600 EXTALM U8780332 600 Series VGA cable 1 52 m 5 ft 600 C VGA 5 U8780298 Communication cable HD15 female single ended 1 83 m 6 ft DSUB HD15 6 U8780333 600 Series products display protectors pack of 10 600 DP U8780297 600 Series soft instr...

Page 232: ...nty Description Part number BondMaster 600 Extended Warranty one additional year including calibration not available in all countries W2 BONDMASTER600 U8775337 B600 to B600M upgrade including resonance probe cable B600 UPG M U8670219 Table 20 Getting Started Guides all languages Description Part number B600 Getting Started Chinese DMTA 10044 01ZH U8670211 B600 Getting Started German DMTA 10044 01D...

Page 233: ...ccessories Replacement Parts and Upgrades 223 B600 Getting Started Spanish DMTA 10044 01ES U8670217 B600 Getting Started Portuguese DMTA 10044 01PT U8670218 Table 20 Getting Started Guides all languages continued Description Part number ...

Page 234: ...DMTA 10045 01EN Rev E August 2016 Appendix B 224 ...

Page 235: ...ower cable 31 Figure 2 9 The battery compartment 33 Figure 2 10 Removing the lithium ion battery 35 Figure 2 11 The alkaline battery holder 36 Figure 2 12 Installing the microSD card 37 Figure 2 13 Overview of the BondMaster 600 Front view 38 Figure 2 14 Overview of the BondMaster 600 Back view 39 Figure 2 15 The BondMaster 600 front panel with SmartKnob and keypad 40 Figure 2 16 The BondMaster 60...

Page 236: ... PC Swept mode s alarm DWELL setting control 98 Figure 5 15 The PC Swept mode s alarm HORN setting control 98 Figure 5 16 The PC Swept mode s BOX alarm shape controls 100 Figure 5 17 The PC Swept mode s SECTOR alarm shape controls 101 Figure 5 18 The PC Swept mode s CIRCLE alarm shape controls 102 Figure 5 19 The MIA mode s alarm DWELL setting controls 104 Figure 5 20 The MIA mode s alarm HORN set...

Page 237: ...d upwards 140 Figure 6 26 The signal amplitude adjusted to enter the alarm box 140 Figure 6 27 The second scan over the disbond 141 Figure 6 28 The list of all parameters 142 Figure 6 29 Materials repaired areas potting using MIA technique 142 Figure 6 30 The Smaller Disbonds and Repair Identification application 143 Figure 6 31 Adjusting the dot position 144 Figure 6 32 The scan over the disbond ...

Page 238: ... Figure 6 65 Selecting the best operating frequency 170 Figure 6 66 Adjusting the angle to move the dot upwards 171 Figure 6 67 The GAIN adjustment to the air signal dot 172 Figure 6 68 The second scan over the defect s 172 Figure 7 1 BondMaster PC Device menu 174 Figure 7 2 The Capture Screen dialog box 174 Figure 7 3 The ABOUT menu 175 Figure 7 4 The UPGRADE menu 176 Figure 7 5 The message indic...

Page 239: ...mand 202 Figure 7 25 The Backup dialog box start 203 Figure 7 26 The Confirmation dialog box to confirm backup start 203 Figure 7 27 The Backup dialog box complete 203 Figure 7 28 The Restore command 204 Figure 7 29 The Restore dialog box start 204 Figure 7 30 The Confirmation dialog box to confirm the restore start 204 Figure 7 31 The Restore dialog box complete 205 ...

Page 240: ...DMTA 10045 01EN Rev E August 2016 List of Figures 230 ...

Page 241: ...output specifications 212 Table 10 BondMaster 600 Input Output 15 pin I O connector 212 Table 11 BondMaster 600 VGA 15 pin port output 212 Table 12 Bond testing specifications 213 Table 13 Pitch catch tone burst and swept mode specifications 215 Table 14 Mechanical impedance analysis and resonance mode specifications 217 Table 15 Alarms connectivity and memory specifications 218 Table 16 Interface...

Page 242: ...DMTA 10045 01EN Rev E August 2016 List of Tables 232 ...

Page 243: ...screen 66 B backup instrument 201 battery alkaline installing 35 charging lithium 207 compartment connection 32 cover 39 location 33 thumb screws 33 vent 39 holder alkaline 35 precautions 10 bond testing specifications 213 box contents 20 brightness of display 65 buttons power and lock 71 C capture screen 72 173 carton unpacking 19 CAUTION signal word 8 cautions display window damage 50 electric s...

Page 244: ...nu keys 71 power and lock buttons 71 SmartKnob 72 cover battery compartment 39 crosshairs screen 67 D DANGER signal word 7 data export as PDF 178 date setting 64 DC power connector 26 39 decimal symbol 63 delamination interply 153 development inspection procedure 160 direct current symbol 3 direct function keypad 40 DISP DOTS menu MIA mode 91 PC RF mode 84 PC Swept mode 90 RESON mode 92 display 70...

Page 245: ... requirements 28 reset 118 specifications 209 stand 49 interface 51 main inspection screen 53 menu selection 55 specifications 218 interply delamination 153 introduction 17 IP rating 50 issue commands 180 K keys configuration on keypad 40 direct function 40 43 70 function 71 menu 44 71 power location 29 knob parameter adjustment SmartKnob 39 72 Korea Communications Commission KCC 3 13 L labels 1 r...

Page 246: ... 212 VGA connector 212 pitch catch swept mode specifications 214 pitch catch tone burst mode specifications 214 power button key 29 71 indicator 29 requirements instrument 28 status 32 PowerLink probe 69 probe menu 53 precautions battery 10 safety 9 principle of operation 23 probe care and diagnostics 208 connector 39 drive menu 77 protection display 50 Q quick setup instrument 53 113 R rating lab...

Page 247: ...r varying geometry 133 slot microSD 27 37 48 smaller disbonds MIA technique 137 SmartKnob 39 software menu navigation 53 menus 73 PC 173 PowerLink menu 53 upgrade 175 user interface 51 specifications alarms 217 bond testing 213 connectivity 217 general and environmental 209 input output 212 interface 218 mechanical impedance analysis mode 216 memory 217 pitch catch swept mode 214 pitch catch tone ...

Page 248: ...uage 63 V vent membrane 33 39 VGA connector pinout 212 VGA OUT connector 27 28 39 46 W WARNING signal word 8 warning symbols general 7 instrument marking 4 shock hazard 7 warnings AC power cord 26 29 charger adaptor 30 electrical 10 general 9 misuse of instrument 5 warranty information 15 waste electrical and electronic equipment WEEE 12 WEEE directive details 12 symbol 3 ...

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