Ozito PLR-750, Instruction Manual

The planer has a precision machined ‘V’ groove in the Front Base 

Plate for making 45

o

 chamfers along the edges of your workpiece.

PLR-750

4.  PLANING

5.  REBATE CUTS

2   Place the groove 

precisely on the corner 

of the workpiece.

1   Set the required depth on the 

planer.

NOTE:

 A layer of material will 

be removed from the workpiece 

even if the cutting depth is set 

to 0; always test the setting on a 

scrap workpiece first.

1   Set the required depth on the 

planer.

NOTE:

 For finishing surfaces, 

use a low chip depth and 

make multiple passes over the 

material.

2   Switch on the planer. 

3   Lower the planer onto the 

workpiece, and push the planer 

over the surface with both hands. 

NOTE:

 Ensure that both base plates 

lie flat along the material during 

planing.

NOTE:

 Ensure the operating 

pressure is applied to the rear base 

plate when lifting the planer off the 

material.

5   Switch on the planer. 

6   Plane along workpiece, using the Parallel Guide to keep the 

planer square to the material.

7   The Rebate Guide indicates when the required rebate height is 

achieved. Keep planing along the workpiece until the Rebate 

Guide touches the surface of the rebate.

2   Adjust the Parallel Guide to 

the appropriate width.

3   Adjust the Rebate Guide 

to the height of the desired 

rebate.

4   Adjust the chip depth by 

turning the Depth Adjustment 

Knob.

NOTE:

 It is recommended that rebates are formed over several 

passes. A 6mm rebate can be formed by making 3 passes over the 

material at a depth setting of 2mm.

1   Mark out the area for rebate 

and clamp the workpiece 

down.

1

1

2

Chamfering Edges

Making a Rebate Cut

Planing Flat Surfaces

3   Plane along the edge of 

your workpiece.