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I
NSTRUCTION
M
ANUAL
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
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Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
NANO 1000T / FEMTO 1500
Polishing Head
The purpose of the rough polishing step is to remove the damage produced during cutting and planar
grinding. Proper rough polishing will maintain specimen flatness and retain all inclusions or
secondary phases. By eliminating the previous damage and maintaining the microstructural integrity
of the specimen at this step, a minimal amount of time is required to remove the cosmetic damage at
the final polishing step.
Rough polishing is accomplished primarily with diamond abrasives ranging from 9 micron to 1
micron. Polycrystalline diamond -- because of its multiple and small cutting edges -- produces high
cut rates with minimal surface damage. Therefore, polycrystalline diamond abrasives are
recommended for metallographic rough polishing on low-napped polishing cloths.
5.10.2 Rough Polishing
Rough Polishing Guidelines
Material
Recommendations
Metals (ferrous, non-ferrous,
tool steels, superalloys, etc.)
Rough polishing typically requires two polishing steps, e.g., a 6-
micron diamond followed by a 1-micron diamond on low-napped
polishing cloths.
Ceramics and ceramic matrix
composites (CMC)
Low-nap polishing pads using polycrystalline diamond, alternating
with colloidal silica. This provides a chemical mechanical
polishing (CMP) effect which results in a damage-free surface
Polymer matrix composites
(PMC)
Diamond-lapping films are recommended.
Biomaterials
Low-napped polishing pads with polycrystalline diamond,
alternating with colloidal silica. Alternatively, diamond-lapping
films may work well.
Microelectronic specimens
Diamond-lapping films are recommended.
Plastics and polymers
800 and 1200 grit SiC abrasive paper are recommended.
Plasma spray materials
Diamond-lapping films or low-napped polishing pads with
alternating diamond and colloidal silica abrasives.