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I
NSTRUCTION
M
ANUAL
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
39
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
NANO 1000T / FEMTO 1500
Polishing Head
CLASS 4 Polishing Procedures
5.11.4 Microelectronics
The microstructural preparation of electronic packages presents some very
difficult challenges, such as abrasives embedding in very soft solder joints,
edge rounding, polishing relief between very hard (ceramic) or brittle
(silicon) materials and the very soft plastic and metal solders. The use of
alumina lapping films are very useful for maintaining flatness and for
minimizing fractured abrasive embedding for non-ceramic substrates. For
specimens with ceramic substrates, diamond lapping films are recommended.
Abrasive/surface
Lubricant
FEMTO pressure
setting (psi)
Head / Wheel speed
Time
30 micron alumina lapping
film*
POLYLUBE
Extender
5-10 lbs
100/100 rpm
Until plane
15 micron alumina lapping
film*
POLYLUBE
Extender
5-10 lbs
100/100 rpm
1-2 minutes
9 micron alumina lapping
film
POLYLUBE
Extender
5-10 lbs
100/100 rpm
1-2 minutes
6 micron alumina lapping
film
POLYLUBE
Extender
5-10 lbs
100/100 rpm
1-2 minutes
3 micron alumina lapping
film
POLYLUBE
Extender
5-10 lbs
100/100 rpm
1-2 minutes
1 um DIAMAT diamond on
ATLANTIS polishing pad
DIALUBE
Purple Extender
5-10 lbs
100/100 rpm
1-2 minutes
SIAMAT colloidal silica on a
MICROPAD polishing pad
5-10 lbs
100/100 rpm
1 minute
* Recommended for Central Force holders (this step not required for Individual Force holders)
Electronic die cross section
Electronic die cross section