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I
NSTRUCTION
M
ANUAL
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
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Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
NANO 1000T / FEMTO 1500
Polishing Head
CLASS 9 Polishing Procedures
5.11.9 Metal Matrix Composites
Hard particles in a metal matrix can be difficult to prepare
because of particle pull-out as well as excessive relief between
the particles and the matrix. The key to preparation of metal
matrix composites (MMC) is to minimize damage at each
preparation stage. This includes sectioning with the appropriate
diamond wafering blade and using the finest practical abrasive
for initial grinding. Polishing with SIAMAT colloidal silica provides
a chemical mechanical polishing (CMP) action which is the most
effective means for eliminating both surface and subsurface damage. The combination of SIAMAT
colloidal silica with DIAMAT polycrystalline diamond also produces the required surfaces finishes in a
minimal amount of time.
Abrasive/surface
Lubricant
FEMTO pressure
setting (psi)
Head / Wheel speed
Time
30 um DIAMAT diamond
suspension on CERMESH Metal
Mesh cloth
5-10 lbs
200/200 rpm
Until plane
9 um DIAMAT diamond on
POLYPAD polishing pad
5-10 lbs
200/200 rpm
3 minutes
3 um DIAMAT diamond on
TEXPAN polishing pad
SIAMAT
colloidal silica
5-10 lbs
200/200 rpm
3 minutes
0.05 micron NANOMETER
alumina on TRICOTE polishing
pad
5-10 lbs
100/100 rpm
1 minute
SiC particles in an Aluminum Matrix, 400X (DIC)
Zirconium Diboride particles in a Titanium Matrix
Etched, 1000X (DIC)