Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
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PICO-155S Precision Saw
I
NSTRUCTION
M
ANUAL
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3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
9.3 RECOMMENDED WAFER CUTTING PROCEDURES
-Prior to cutting the sample, condition or dress the wafering blade with the appropriate dressing stick.
-Clamp the specimen sufficiently so that the sample does not shift during cutting. If appropriate, clamp
both sides of the specimen in order to eliminate the cutting burr which can form at the end of the cut.
-For brittle materials clamp the specimen with a rubber pad to absorb vibration from the cutting
operation.
-Begin the cut with a lower force in order to set the blade cutting kerf.
-Orient the specimen so that it is cut through the smallest cross section.
-For samples with coatings, keep the coatings in compression by sectioning through the coating and into
the substrate material.
-Use largest appropriate blade flanges to prevent the blade from wobbling or flexing during cutting.
-Reduce the force toward the end of the cut for brittle specimens
-Use the appropriate cutting fluid.