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Features
3.5 inch resistive touch screen.
11.8 inch (300mm) square, glass-ceramic heating surface.
Four individual IR heating elements arranged in two zones for a total of 1600W, can also be
limited to 800W total across all four heaters.
Closed loop temperature control using one of three different sensors.
Front and Back heating zone cans independently be adjusted ±90°F (50°C) from the set
temperature. (When using the internal sensor.)
Built-in timer function with alarm.
Auto-Off timer function for safety and convenience.
Included adjustable height magnetic board holder.
Board Holder Set-up
The board holder for the PH 100 can be set-up at three different heights to allow for more or less clearance over
the heating plate, or to fit under other equipment. The lowest setting is achieved by gently placing the brightly
polished steel rails, magnet side down, directly on the gray casing to the left and right sides of the glass-ceramic
heating plate. Then place the satin-finished aluminum rails onto the steel rails, with the notched corners facing
inward and the magnets facing down. At this level the bottom of a board sitting in the notches of the board
holder rails, would be 0.375 inches (9.525mm) above the heating plate.
To increase the height of the board holder and provide more clearance, two different sets of magnetic feet have
been included. To prevent damage to the glass-ceramic plate, it is best to remove the aluminum board holder
rails completely before adding the feet underneath the steel support rails. Each foot is notched on one end for
the steel support rails to set into, and the bottom is magnetic with a Teflon pad to help prevent scratches. The
small feet give a clearance of 0.875 inches (22.25mm) from the bottom of a board sitting in the holder, and the
large feet provide clearance of 1.4375 inches (36.513mm).
Preheating Basics
Preheating of a printed circuit assembly is normally required in the repair process whenever any of the following
conditions exist.
Epoxy Glass substrate with 4 or more layers.
The board has large ground planes
The substrate is made of ceramic, polyimide, or other high heat dissipating material.
The board has large metal heat sinks or other items with large thermal mass.
The use of preheating on these materials improves the soldering process by;
Minimizing the time exposed to high temperatures before the solder flows.
Increases efficiency of point heating by overcoming heat dissipation.
Minimizing reflow of surrounding components due to the combination of all of the above.
Minimizing thermal shock to surrounding components by helping to normalize temperatures across the
board.
The assembly being heated must be allowed to soak for a length of time to ensure the desired temperature has
sufficiently saturated throughout the mass. Commonly used preheat temperatures for PCB are 212°F (100°C)
and 248°F (120°C).
