System Operations Manual
www.paceworldwide.com
Page 6 of 40
iii. High power bottom heaters allow for successful and repeatable reflow at
safe, low temperatures.
iv. Profiles are programmed through the PC software.
v. Creating the perfect profile is easy with real time adjustment of profile
parameters through the PC.
vi. Store and recall an infinite number of profiles.
vii. Two pre-defined profiles for use as baselines when developing custom
profiles are included.
viii. Self contained, no external air supply or vacuum connections required.
Can also be used with N
2
from external source.
ix. Semi-automated, motorized reflow head.
x. Four thermo-couple sensor inputs ensure successful profile development
and monitoring.
xi. External fan to cool PCB and component to below solder melt
temperatures after reflow.
e. ALIGNMENT AND PLACEMENT FUNCTION
i. The component is held by a precision vacuum placement pick, which is
located within the heater assembly.
ii. High resolution Dual Color Vision Overlay System (VOS) with color
camera and dichroic prism. VOS does not require routine calibration,
eliminating costly downtime and operator frustration.
iii. Color Camera with 72x zoom capability, featuring auto-focus zoom.
iv. Lighting system uses “Ultra Bright” Red and Blue LEDs for maximum
contrast of lands and solder balls on component.
v. Independent lighting controls for component and PCB to maximize
overlay contrast.
vi. Retractable optics housing protects VOS from dirt and contamination.
vii. Accurately places any array package up to 35mm (1.3") square and as
small as 1 mm (.04”) square.
viii. Precise micrometer adjustment for X, and Y axis with Theta adjustment
ensures placement accuracy.
ix. High-flow vacuum pick holds component securely.
x. Images are viewed through the PC in standard or full screen viewing
options.
f. PRE-HEAT
FUNCTION AND BOARD HOLDER
i. Fully adjustable, precision, spring loaded board holder with top or bottom
PCB registration. Precise micrometer adjustment for X and Y adjustment
ensures placement accuracy for repeatability.
ii. Rugged, stable board platform to hold and support the PCB.
iii. Unique board holding fixtures that are able to hold very small and odd
shaped PCBs.
iv. Board supports are standard with the system.
v. Integrated, powerful, IR pre-heater with closed loop temperature control
ensures process integrity by delivering heat evenly, time after time.
