20
Chapter 1
Super-Multi Drive Module
Audio Interface
Item
Specification
Vendor & model
name
HLDS GT20N
Sony AD7580S
Performance
Specification
With CD Diskette
With DVD Diskette With CD Diskette
With DVD Diskette
Transfer rate (MB/
sec)
Sustained:
3,600 KB/s (24x)
max.
Sustained:
11.08 Mbytes/s
(8x) max.
Sustained:
1,571 (typical)
Sustained:
10,993 (typical)
Buffer Memory
2 MB
Interface
SATA
Applicable disc
formats
DVD-ROM:
4.7GB (Single Layer)
8.5GB (Dual Layer)
DVD-R:
3.95GB (Ver. 1.0: read only)
4.7GB (Ver. 2.0 for Authoring: read only)
4.7GB (Ver. 2.1 for General: read & write)
(DL) 8.5GB (Ver. 3.0)
DVD-RW:
4.7GB (Ver. 1.2/ Rev 1.0, 2.0, 3.0)
DVD-RAM: 1.46GB/side, 4.7GB/side
(Ver. 2.2)
DVD+R: 4.7GB (Ver. 1.3)
(DL) 8.5GB (Ver. 1.1)
DVD+RW:
4.7GB (Vol.1 Ver.1.3)
CD-ROM Mode-1 data disc
CD-ROM Mode-2 data disc
CD-ROM XA, CD-I, Photo-CD Multi-
Session, Video CD
CD-Audio Disc
Mixed mode CD-ROM disc (data and
audio)
CD-Extra
CD-Text
CD-R (Conforming to “Orange Book Part
2”: read & write)
CD-RW (Conforming to “Orange Book
Part 3”: read & write)
DVD Read:
DVD-ROM (DVD-5, DVD-9, DVD-10, DVD-
18), DVD-Video, DVD-Audio, SACD (Hybrid),
UDF DVD, DVD-R, DVD-R DL, DVD-R 3.95
GB, DVD-R Authoring, DVD-R Multi-Border,
DVD-RW, DVD+R, DVD+R DL, DVD+R
Multi-Session, DVD+RW, DVD-RAM V1.0,
DVDRAM
V2.0 & 2.1 &2.2.
CD Read:
CD-DA, CD-ROM Mode-1, CD-ROM/XA
Mode-2 Form-1 and Mode-2 Form-2, CD-i,
CD-i
Bridge, Video-CD (MPEG-1), Karaoke CD,
Photo-CD, Enhanced CD, CD Plus, CD
Extra, itrax
CD, CD-Text, UDF CD, CD-R, and CD-RW
DVD Write:
DVD Data & Video
CD Read:
CD-DA, CD-ROM Mode-1, CD-ROM/XA
Mode-2 Form-1 and Mode-2 Form-2, CD-i,
Video-
CD, CD-Text
Loading mechanism
Drawer (Solenoid Open)
Tact SW (Open)
Emergency Release (draw open hole)
Power Requirement
Input Voltage
DC 5 V +/- 5%
Item
Specification
Chipset
Realtek ALC272-X
Summary of Contents for TM86 Series
Page 6: ...VI ...
Page 10: ...X Table of Contents ...
Page 15: ...Chapter 1 5 System Block Diagram ...
Page 62: ...52 Chapter 3 4 Remove one 1 screw from the 3G module 5 Lift the 3G card from the slot ...
Page 73: ...Chapter 3 63 3 Disconnect the following four 4 cables from the Mainboard A B C D ...
Page 78: ...68 Chapter 3 5 Lift the Right Speaker Module clear of the upper cover ...
Page 83: ...Chapter 3 73 5 Lift the card reader board clear of the device ...
Page 85: ...Chapter 3 75 5 Lift the USB board clear of the device ...
Page 92: ...82 Chapter 3 5 Carefully lift the Thermal Module clear of the Mainboard ...
Page 101: ...Chapter 3 91 5 Turn the board over and disconnect the cable ...
Page 103: ...Chapter 3 93 4 Lift the LCD Panel clear of the module ...
Page 105: ...Chapter 3 95 5 Disconnect the LVDS cable from the panel ...
Page 107: ...Chapter 3 97 5 Lift the microphone set clear of the panel ...
Page 114: ...104 Chapter 3 4 Replace six 6 securing screws three on each side of the LCD Panel brackets ...
Page 126: ...116 Chapter 3 6 Connect the LVDS cable and lock the connector 7 Connect the microphone cable ...
Page 131: ...Chapter 3 121 4 Replace the FFC and press down as indicated to secure it to the Upper Cover ...
Page 187: ...Chapter 6 177 ...
Page 188: ...Appendix A 178 Model Definition and Configuration Appendix A ...
Page 212: ...202 Appendix C ...
Page 216: ...206 ...