©2020 PACE Inc., Vass, North Carolina,
All Rights Reserved
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Procedure
It is recommended to conduct a trial operation each day before commencing with production to ensure
the heater temperatures will be uniform and that everything is operating correctly.
Before operation, check for any components on both the top and bottom of the PCB that may not fit in
the machine. Ensure the components are not going to crash into the heater head or camera arm as they move
up/down and in/out. Also check that the bottom heater will not be obstructed and does not make physical
contact with components on the board as this could cause uneven heating.
Production Mode
Example component installation – Note: If at any time you need to abort the process, click
on the red “Abort” button.
1)
First, power on the IR machine then PC, then initialize the software.
2)
Navigate to the Profiler screen, if not already there.
3)
Load a profile using the Load Profile button.
4)
Install vacuum pick.
5)
If desired use appropriate heater baffle.
6)
Click “Start Process” and follow the onscreen instructions which will guide you through the
following steps.
7)
Place the PCB between the arms of the board holder and position the board so the red
laser point is in the center of the placement site and tighten the board holder retention
screw.
8)
Adjust the Board Support Wand as needed.
9)
Place the component in the mounting plate on top of the camera housing. Click “Okay”.
10)
The BGA workstation will pick up component. If the vacuum pick fails to pick up the
component, reset the component in the nest and click “Retry”.
11)
Slide component nest out of the way, towards the back of the machine so the optics are
unobstructed.
12)
If Auto Flux Dip is selected, replace the component nest with the flux dip tray and follow
onscreen directions. After fluxing is complete, restore flux dip tray and component nest to
their original locations.
13)
The component alignment screen will appear and the heater head will move down to the
focal position.
14)
Adjust the zoom and lighting as needed in order to see the pads on the PCB as well as
the solder balls or leads on the component. Then using the theta adjustment and X/Y
micrometers, align the component to the PCB.
15)
After alignment is complete, click the Alignment Complete button to prepare for heating.
16)
If Apply flux to PCB is active, the heater head will remain stationary and will guide
applying flux to board. Then hit Okay.
17)
The heater head will place the component into position over the board.
18)
Verify bottom heater height reminder may appear.
19)
Make sure IR Pyrometer or external thermocouples being used are in the correct location
and click the Start Heating Button.
20)
The selected temperature profile will run.
21)
Allow the PCB to cool and remove.
Example component removal – Note: If at any time you need to abort the process, click on the
red “Abort” button.
1)
First, power on the IR machine then PC, then initialize the software.
