Operation manual for Narrow-pitch connectors A35UH
Panasonic Corporation
industrial.panasonic.com/ac/e/
©
Panasonic Corporation 2017
ACCTF32E 201704
- 10 -
(2)
FPC board specifications
Control the thicknesses of the coverlay and adhesive to prevent poor
soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the coverlay, etc. so as to prevent the
occurrence of poor soldering.
If poor soldering occurs frequently, check the actual thickness of each insulation
layer.
Generally, the coverlay thickness is set to about 30 μm, including the
adhesive. If the thickness exceeds 30 μm, design the board so as to remove the
coverlay under the connector.
(3)This connector is often used for connecting the motherboard and FPC board. In
this case, if the FPC board is too short, a load that causes deviation will be applied
to the connector.
Make sure to create a design that provides some allowance in the FPC board.
Connector
terminal
Solder
Molded part of the connector
Coverlay (polyimide)
Adhesive (epoxy adhesive recommended)
Adhesive (epoxy adhesive recommended)
Copper foil
Base material (polyimide)
Reinforcing plate + Adhesive
(epoxy adhesive recommended)
NG: Too long
Fixed
Connector
NG: Too short
Positional deviation
Motherboard
Part where FPC board
is fixed
Summary of Contents for A35UH
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