Stacking connector for high current
B01
–2–
ACCTB71E 201412-T
PRODUCT TYPES
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Stacking height
Number of contacts
Part number
Packing
Socket
Header
Inner carton (1-reel)
Outer carton
0.6mm
6
AXF361500
AXF461500
15,000 pieces
30,000 pieces
0.8mm
6
AXF363500
AXF463500
15,000 pieces
30,000 pieces
Item
Specifications
Conditions
Electrical
characteristics
Rated current
3.0 A/pin (Power contact)
0.3 A/pin (Signal contact)
Rated voltage
30V AC/DC
Insulation resistance
Min. 1,000M
Ω
(Initial stage)
Using 250V DC megger (applied for 1 minute)
Breakdown voltage
150V AC for 1 minute
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Contact resistance
Power contact: Max. 20m
Ω
Signal contact: Max. 90m
Ω
According to the contact resistance measurement method of
JIS C 5402
Mechanical
characteristics
Composite insertion force
Max. 40 N
Composite removal force
Min. 10 N (H: 0.6, Initial stage)
Environmental
characteristics
Ambient temperature
–55
°
C to +85
°
C
No freezing at low temperatures or condensation
Storage temperature
–55
°
C to +85
°
C (Products only)
–40
°
C to +50
°
C (Packaging structure)
No freezing at low temperatures or condensation
Thermal shock resistance
(Header and socket mated)
After 5 cycles
Insulation resistance: Min. 100M
Ω
,
Contact resistance
Power contact: Max. 20m
Ω
Signal contact: Max. 90m
Ω
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(Header and socket mated)
After 120 hours
Insulation resistance: Min. 100M
Ω
,
Contact resistance
Power contact: Max. 20m
Ω
Signal contact: Max. 90m
Ω
Conformed to IEC60068-2-78
Bath temperature 40
±
2
°
C,
Humidity 90 to 95% R.H.
Salt water spray resistance
(Header and socket mated)
After 24 hours
Insulation resistance: Min. 100M
Ω
,
Contact resistance
Power contact: Max. 20m
Ω
Signal contact: Max. 90m
Ω
Conformed to IEC60068-2-11
Bath temperature 35
±
2
°
C,
Salt water concentration 5
±
1%
H
2
S resistance
(Header and socket mated)
After 48 hours
Contact resistance
Power contact: Max. 20m
Ω
Signal contact: Max. 90m
Ω
Conformed to JEIDA-38-1984
Bath temperature 40
±
2
°
C, Gas concentration 3
±
1 ppm,
Humidity 75 to 80% R.H.
Life characteristics
Insertion and removal life
with no load
30 times
• Contact resistance
Power contact: Max. 20m
Ω
Signal contact: Max. 90m
Ω
• Composite removal force: Min. 7 N
Repeated insertion and removal cycles of max. 200 times/
hour
Soldering heat resistance
The initial specification must be satisfied electrically
and mechanically
Max. peak temperature of 260
°
C
Infrared reflow soldering (PC board surface temperature
near connector terminals)
Soldering iron
300
°
C within 5 sec.
350
°
C within 3 sec.
Unit weight
6 pins Socket h = 0.6 mm: 0.010 g h = 0.8 mm: 0.013 g
6 pins Header h = 0.6 mm: 0.004 g h = 0.8 mm: 0.005 g
Part name
Material
Surface treatment
Molded portion
Heat resistant plastic (LCP resin)
(UL94V-0)
—
Contact and Post
Copper alloy
Contact portion (Main): Au plating (Min. 0.1
μ
m) over nickel
Contact portion (Sub): Au plating (Min. 0. 05
μ
m) over nickel
Terminal portion: Au plating over nickel (except for top of the terminal)
Soldering terminals (Socket): Pd + Au flash plating over nickel (except for top of the terminal)
Soldering terminals (Header): Au plating over nickel (except for top of the terminal)
Order Temperature (
°
C)
Time (minutes)
1
2
3
4
–55
85
–55
0
−
3
30
Max. 5
30
Max. 5
+
3
0
0
−
3
