7
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semi-
conductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to damage an ES device).
Summary of Contents for DMP-BDT110GC
Page 2: ...2 ...
Page 6: ...6 1 3 Caution for AC cord Only for BDT110GC ...
Page 8: ...8 2 2 Precaution of Laser Diode ...
Page 10: ...10 3 Service Navigation 3 1 Service Information ...
Page 15: ...15 5 Location of Controls and Components ...
Page 16: ...16 ...
Page 42: ...42 4 Apply the lubricants to the 7 points as shown in Figure ...
Page 43: ...43 9 3 3 How to Clean the Lens of Optical Pick UP ...
Page 44: ...44 9 4 Adjustment of BD Drive 9 4 1 Repair Flowchart ...
Page 45: ...45 9 4 2 Distinction Analysis 9 4 2 1 Distinction Analysis Flowchart ...
Page 49: ...49 10 1 2 Checking and Repairing of Digital P C B ...
Page 71: ...71 16 Schematic Diagram for printing with A4 size ...