2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage
an ES device).
5
DMR-ES35VP / DMR-ES35VPC
Summary of Contents for DMR-ES35VP
Page 6: ...2 2 Precaution of Laser Diode 6 DMR ES35VP DMR ES35VPC ...
Page 8: ...3 Service Navigation 3 1 Service Information 8 DMR ES35VP DMR ES35VPC ...
Page 9: ...4 Specifications 9 DMR ES35VP DMR ES35VPC ...
Page 10: ...5 Location of Controls and Components 5 1 Each Buttons 10 DMR ES35VP DMR ES35VPC ...
Page 11: ...11 DMR ES35VP DMR ES35VPC ...
Page 31: ...9 2 P C B Positions 31 DMR ES35VP DMR ES35VPC ...
Page 41: ...10 1 2 Checking and Repairing of Main P C B 41 DMR ES35VP DMR ES35VPC ...
Page 42: ...10 1 3 Checking and Repairing of RAM Digital P C B Module 42 DMR ES35VP DMR ES35VPC ...
Page 44: ...10 2 3 Items that should be done after replacing parts 44 DMR ES35VP DMR ES35VPC ...
Page 45: ...45 DMR ES35VP DMR ES35VPC ...
Page 60: ...60 DMR ES35VP DMR ES35VPC ...
Page 68: ...DMR ES35VP DMR ES35VPC 68 ...
Page 104: ...DMR ES35VP DMR ES35VPC 104 ...
Page 105: ...16 Exploded Views 16 1 Casing Parts Mechanism Section1 105 DMR ES35VP DMR ES35VPC ...
Page 106: ...16 2 Casing Parts Mechanism Section 2 106 DMR ES35VP DMR ES35VPC ...
Page 107: ...16 3 VHS Mechanism Section 107 DMR ES35VP DMR ES35VPC ...
Page 108: ...16 4 Packing Accessories Section 108 DMR ES35VP DMR ES35VPC ...