Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©
Panasonic Corporation 2017
ACCTF5E-5 201704
- 8 -
(6)
Pay attention to the following points when providing a through hole by
extending the foot pattern.
If a through-hole is created simply by extending the foot pattern by the same
width, solder is absorbed into the through-hole during the reflow process, which
may cause defective or poor soldering of the terminals.
①
Thin and extend the tip of the foot
pattern before creating a through-hole.
②
Prevent solder from reaching the land
by using a coverlay or resist.
(7)
Pay attention to the following point as a pattern
peeling preventive measure when removing the
connector.
-
Make the foot pattern length longer than the
coverlay opening.
In general, at least 0.3 mm.
(8)Foot pattern dimensions indicated in the drawings are
intended to achieve the minimum area on the premise
that the reflow-soldering process is used.
For manual
soldering or for ensuring solder reworkability, make
a longer pattern at the terminal tip.
In general, 1/3 the
terminal pattern
width.
- Secure space for applying the soldering
iron tip.
Terminal looseness and unwanted
solder creep are preventable by
applying the soldering iron tip here.