4
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Summary of Contents for HC-V100EB
Page 9: ...9 3 5 Formatting ...
Page 10: ...10 4 Specifications ...
Page 11: ...11 ...
Page 18: ...18 8 3 1 Removal of the Top Case Unit Fig D1 Fig D2 ...
Page 20: ...20 Fig D6 8 3 4 Removal of the Lens Unit Fig D7 Fig D8 ...
Page 21: ...21 8 3 5 Removal of the Main P C B and SD Holder P C B Fig D9 Fig D10 ...
Page 23: ...23 Fig D14 ...
Page 34: ...Model No HC V100 V100M Schematic Diagram Note ...
Page 35: ...Model No HC V100 V100M Parts List Note ...
Page 36: ...Model No HC V100 V100M Main Connection Main P C B ...
Page 37: ...Model No HC V100 V100M Video Main P C B ...
Page 38: ...Model No HC V100 V100M HD Video Main P C B ...
Page 39: ...Model No HC V100 V100M Lens Drive Main P C B ...
Page 40: ...Model No HC V100 V100M Syscon Main P C B ...
Page 41: ...Model No HC V100 V100M Charge RTC Main P C B ...
Page 42: ...Model No HC V100 V100M MIC Main P C B ...
Page 43: ...Model No HC V100 V100M Power Main P C B ...
Page 44: ...Model No HC V100 V100M MOS Connection Main P C B ...
Page 45: ...Model No HC V100 V100M SD Holder SD Holder P C B ...
Page 46: ...Model No HC V100 V100M Main P C B Component Side ...
Page 47: ...Model No HC V100 V100M Main P C B Foil Side ...
Page 48: ...Model No HC V100 V100M SD Holder P C B Component Side ...
Page 49: ...Model No HC V100 V100M SD Holder P C B Foil Side ...
Page 59: ...Model No HC V100 V100M Frame and Casing Section ...
Page 60: ...Model No HC V100 V100M Packing Parts and Accessories Section ...
