8
3.4.
Baking of replacement IC and defective P.C.B.
When replacing the CSP/BGA/QFN type IC mounted on the P.C.B., the problem of IC crack or foil pattern breaking in the P.C.B.
might sometimes occur by rapid heating.
In order to improve the success rate of IC replacement for repair, it would be required to work out baking of replacement
IC and defective P.C.B. before replacing IC.
Please refer the way of baking as follows.
Replacement IC and defective P.C.B. must be put in the heater together.
• Baking temperature and time (Hour)
80°C / 24 hour
Summary of Contents for HC-V380PP
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Page 24: ...24 8 2 PCB Location ...
Page 27: ...27 8 3 1 Removal of the Side Case L Unit Fig D1 Fig D2 ...
Page 31: ...31 Fig D12 Fig D13 ...
Page 33: ...33 Fig D17 Fig D18 ...
Page 34: ...34 8 3 10 Removal of the LCD Hinge Unit Fig D19 Fig D20 ...
Page 35: ...35 8 3 11 Removal of the Monitor P C B LCD Fig D21 Fig D22 ...
Page 38: ...38 8 3 14 Removal of the MOS Unit IR Cut Glass Fig D27 Fig D28 ...
Page 39: ...39 Fig D29 8 3 15 Removal of the 2nd Stepping Motor Fig D30 ...
Page 40: ...40 Fig D31 8 3 16 Removal of the 3rd Stepping Motor Fig D32 ...
Page 41: ...41 Fig D33 8 3 17 Removal of the Focus Stepping Motor Fig D34 ...
Page 42: ...42 Fig D35 ...
Page 45: ...45 Level Shot Adjutment Chart ...
Page 47: ...47 9 1 2 Adjustment Items Adjustment item as follows ...
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