4
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Summary of Contents for HC-V750EB
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Page 31: ...31 8 2 PCB Location ...
Page 34: ...34 8 3 1 Removal of the Side Case L Unit Fig D1 Fig D2 ...
Page 35: ...35 Fig D3 8 3 2 Removal of the Top Case Top Operation Fig D4 ...
Page 36: ...36 Fig D5 Fig D6 ...
Page 37: ...37 8 3 3 Removal of the Front Case Unit Fig D7 Fig D8 ...
Page 39: ...39 Fig D12 Fig D13 ...
Page 41: ...41 Fig D16 Fig D17 8 3 9 HC W850M V750M only Removal of the ESD P C B Unit Fig D18 ...
Page 42: ...42 8 3 10 Removal of the BR Frame Unit Speaker LCD Unit Fig D19 Fig D20 ...
Page 44: ...44 Fig D24 8 3 13 HC V750 V757 V750M V730 Removal of the LCD Hinge Unit Fig D25 ...
Page 45: ...45 Fig D26 8 3 14 Removal of the Monitor P C B LGP Unit LCD Fig D27 ...
Page 46: ...46 Fig D28 8 3 15 Removal of the Mic P C B Fig D29 ...
Page 47: ...47 8 3 16 Removal of the Front Base Barrier R Barrier F Photo Light P C B Fig D30 Fig D31 ...
Page 49: ...49 Fig D34 8 3 19 Removal of the Kurupon Unit Front P C B Fig D35 ...
Page 54: ...54 Level Shot Adjutment Chart ...
Page 56: ...56 9 1 2 Adjustment Items Adjustment item as follows ...
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